公开(公告)号：US09359513B1

公开(公告)日：2016-06-07

申请号：US14305559

申请日：2014-06-16

Applicant: Thin Film Electronics ASA

Inventor： Mao Takashima ,  Inna Tregub ,  Wenzhuo Guo ,  Brian Bedwell ,  Klaus Kunze ,  Aditi Chandra ,  Arvind Kamath ,  Jun Li ,  Li Li ,  Junfeng Mei

IPC: C09D11/107

CPC classification number: C09D11/107 ,  C09D11/52 ,  H01L51/0005

Abstract: Printable dopant formulations, methods of making such dopant formulations, and methods of using such dopant formulations are disclosed. The dopant formulations provide a printable dopant ink with a viscosity sufficient to prevent ink spreading when deposited in a pattern on a substrate. Furthermore, an ion exchange purification process provides the dopant formulation with a reduced metal ion concentration, and thus a relatively high purity level. Consequently, the dopant residue remaining on the substrate after curing and/or dopant activation process is relatively uniform, and therefore can be easily removed.

Abstract translation: 公开了可印刷掺杂剂配方，制备这种掺杂剂配方的方法，以及使用这种掺杂剂配方的方法。 掺杂剂配方提供可印刷的掺杂剂油墨，其具有足够的粘度，以防止当以基板上的图案沉积时的油墨扩散。 此外，离子交换纯化方法为掺杂剂配方提供降低的金属离子浓度，从而提供相当高的纯度水平。 因此，在固化和/或掺杂剂活化过程之后残留在基板上的掺杂剂残留物相对均匀，因此可以容易地除去。

公开(公告)号：US10826158B2

公开(公告)日：2020-11-03

申请号：US16287126

申请日：2019-02-27

Applicant: Thin Film Electronics ASA

Inventor： Somnath Mukherjee ,  Aditi Chandra ,  Mao Ito ,  Arvind Kamath ,  Scott Bruner ,  Sambhu Kundu ,  Anand Deshpande

IPC: H01L23/52 ,  H01Q1/22 ,  H01L23/532 ,  H01L23/528 ,  H01L23/64 ,  H01L23/522 ,  H01L23/66

Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.

公开(公告)号：US09947988B2

公开(公告)日：2018-04-17

申请号：US15230348

申请日：2016-08-05

Applicant: Thin Film Electronics ASA

Inventor： Mao Takashima ,  Aditi Chandra ,  Somnath Mukherjee ,  Gloria Wong ,  Khanh Van Tu ,  Joey Li ,  Anton Popiolek ,  Arvind Kamath

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q7/06

CPC classification number: H01Q1/2291 ,  H01Q7/06

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.