-
公开(公告)号:US10371737B2
公开(公告)日:2019-08-06
申请号:US15626512
申请日:2017-06-19
Applicant: Thin Film Electronics ASA
Inventor: Somnath Mukherjee
IPC: G01R27/28 , G01R31/02 , B65D79/02 , G01N27/02 , G01D5/20 , G08B13/12 , G08B13/24 , G06K19/07 , A61M15/00
Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
-
公开(公告)号:US10826158B2
公开(公告)日:2020-11-03
申请号:US16287126
申请日:2019-02-27
Applicant: Thin Film Electronics ASA
Inventor: Somnath Mukherjee , Aditi Chandra , Mao Ito , Arvind Kamath , Scott Bruner , Sambhu Kundu , Anand Deshpande
IPC: H01L23/52 , H01Q1/22 , H01L23/532 , H01L23/528 , H01L23/64 , H01L23/522 , H01L23/66
Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.
-
3.
公开(公告)号:US09985691B2
公开(公告)日:2018-05-29
申请号:US15655081
申请日:2017-07-20
Applicant: Thin Film Electronics ASA
Inventor: Somnath Mukherjee
CPC classification number: H04B5/0012 , H01L23/66 , H01L29/94 , H01L2223/6677 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H04B1/04 , H04B1/16 , H04B5/0062
Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.
-
公开(公告)号:US11119158B2
公开(公告)日:2021-09-14
申请号:US16309673
申请日:2017-06-19
Applicant: Thin Film Electronics ASA
Inventor: Somnath Mukherjee , James Godfrey
IPC: G01R31/50 , G01D5/20 , G08B13/12 , G08B13/24 , G06K19/07 , B65D79/02 , G01N27/02 , A61M15/00 , H04B5/00 , H04Q9/00
Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
-
公开(公告)号:US09947988B2
公开(公告)日:2018-04-17
申请号:US15230348
申请日:2016-08-05
Applicant: Thin Film Electronics ASA
Inventor: Mao Takashima , Aditi Chandra , Somnath Mukherjee , Gloria Wong , Khanh Van Tu , Joey Li , Anton Popiolek , Arvind Kamath
CPC classification number: H01Q1/2291 , H01Q7/06
Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.
-
-
-
-