公开(公告)号：US20070097650A1

公开(公告)日：2007-05-03

申请号：US11566992

申请日：2006-12-05

申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew Schaenzer

发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew Schaenzer

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L21/4871 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

摘要翻译： 电子组件包括衬底，附接到衬底的器件以及覆盖该器件和该衬底的至少一部分的导热散热器。 金属基本上填充了装置和导热散热器之间的空间。 一种方法包括将至少一个管芯附接到衬底，将热传导散热器放置在管芯上，以及将熔融金属材料注入到导热散热器和管芯之间的空间中。

公开(公告)号：US20050218508A1

公开(公告)日：2005-10-06

申请号：US10815185

申请日：2004-03-31

申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew Schaenzer

发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew Schaenzer

IPC分类号： H01L21/48 ,  H01L23/34 ,  H01L23/42

CPC分类号： H01L23/42 ,  H01L21/4871 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

摘要翻译： 电子组件包括衬底，附接到衬底的器件以及覆盖该器件和该衬底的至少一部分的导热散热器。 金属基本上填充了装置和导热散热器之间的空间。 一种方法包括将至少一个管芯附接到衬底，将热传导散热器放置在管芯上，以及将熔融金属材料注入到导热散热器和管芯之间的空间中。

公开(公告)号：US20060027635A1

公开(公告)日：2006-02-09

申请号：US10914359

申请日：2004-08-09

申请人： Matthew Schaenzer ,  Thomas Fitzgerald ,  Tim Renfro ,  Manjit Dhindsa ,  Vaibhav Trivedi

发明人： Matthew Schaenzer ,  Thomas Fitzgerald ,  Tim Renfro ,  Manjit Dhindsa ,  Vaibhav Trivedi

IPC分类号： B23K35/12

CPC分类号： B23K35/02

摘要： The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

摘要翻译： 散热器的底座可以选择性地镀有焊料润湿材料，并焊接到也选择性镀金的整体散热器上。 在另一个实施例中，焊料可以以插入物的形式施加，所述插入物由夹在铟插入物之间的电加热线构成，该铟箔当由插入的线加热时用作焊料。