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公开(公告)号:US08303715B2
公开(公告)日:2012-11-06
申请号:US12183763
申请日:2008-07-31
CPC分类号: H01L21/67742 , H01L21/67109 , H01L21/67248 , H01L21/67754 , H01L21/68742
摘要: A high throughput thermal treatment system for processing a plurality of substrates is described. The thermal treatment system is configured to thermally treat a plurality of substrates chemically treated in a dry, non-plasma environment.
摘要翻译: 描述了用于处理多个基板的高通量热处理系统。 热处理系统被配置为热处理在干燥的非等离子体环境中化学处理的多个基板。
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公开(公告)号:US20100025368A1
公开(公告)日:2010-02-04
申请号:US12183763
申请日:2008-07-31
CPC分类号: H01L21/67742 , H01L21/67109 , H01L21/67248 , H01L21/67754 , H01L21/68742
摘要: A high throughput thermal treatment system for processing a plurality of substrates is described. The thermal treatment system is configured to thermally treat a plurality of substrates chemically treated in a dry, non-plasma environment.
摘要翻译: 描述了用于处理多个基板的高通量热处理系统。 热处理系统被配置为热处理在干燥的非等离子体环境中化学处理的多个基板。
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