LED mounting having increased heat dissipation
    1.
    发明申请
    LED mounting having increased heat dissipation 有权
    LED安装具有增加的散热

    公开(公告)号:US20060202210A1

    公开(公告)日:2006-09-14

    申请号:US11075094

    申请日:2005-03-08

    摘要: There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.

    摘要翻译: 公开了通过使用安装在LCD面板支撑结构上的当前PCB封装来增加LED显示器的散热的系统和方法,从而消除了对金属芯PCB的需要。 在一个实施例中,使用具有散热垫的反向安装的LED来优化到金属层的热传递,然后将金属层放置成与LCD支撑结构接触。

    Light emitting panel
    2.
    发明申请
    Light emitting panel 有权
    发光面板

    公开(公告)号:US20060227545A1

    公开(公告)日:2006-10-12

    申请号:US11103172

    申请日:2005-04-11

    IPC分类号: B60Q1/26

    摘要: In one embodiment, a light emitting panel includes a base panel and a plurality of light emitting elements mounted to the base panel. Each of the light emitting elements produces an illumination pattern having a region of substantially uniform intensity that extends over a radiation angle of at least about 60°. One or more light conditioners are positioned adjacent the base panel to receive and condition light produced by the light emitting elements.

    摘要翻译: 在一个实施例中,发光面板包括基板和安装到基板的多个发光元件。 每个发光元件产生具有在至少约60°的辐射角上延伸的具有基本均匀强度的区域的照明图案。 一个或多个光调节器邻近基板定位以接收和调节由发光元件产生的光。