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公开(公告)号：US07952873B2
公开(公告)日：2011-05-31
申请号：US11426435
申请日：2006-06-26
CPC分类号： H05K7/20636 , H05K7/1404 , H05K7/20454
摘要： A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein the bladder in an inflated state impresses the cooling module against an adjacent electronic circuit card. where the cooling module is forcibly pressed against adjacent electronic circuit card providing increased physical stability to the electronic circuit card as well as provide a cooling technique for the circuit card.
摘要翻译： 冷却模块包括导热板，设置在板的至少一侧的气囊，气囊具有腔室，以及设置在气囊腔室中的流体，其中处于膨胀状态的气囊使冷却模块抵靠相邻的 电子电路卡。 其中冷却模块被强制地压靠在相邻的电子电路卡上，为电子电路卡提供增加的物理稳定性，并为电路卡提供冷却技术。
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公开(公告)号：US5434358A
公开(公告)日：1995-07-18
申请号：US166299
申请日：1993-12-13
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： A ceramic feedthrough for a package for an electronic device provides a plurality of electrical connections through an opening in the package. A method of making the feedthrough and of packaging the electronic device includes electrically conductive paths that are formed from a metal paste applied between green sheets that are joined and cofired to form a ceramic body. Vias extend from an exterior surface of the ceramic body to the paths to complete the electrical connection from outside the package to inside the package. A density of 50 paths per inch or greater may be achieved. The ceramic body may be hermetically sealed into an opening in the package and the body may have a peripheral extension to facilitate attachment of the feedthrough to the package.
摘要翻译： 用于电子设备的封装的陶瓷馈通通过封装中的开口提供多个电连接。 制造馈通和包装电子器件的方法包括由施加在接合并共烧以形成陶瓷体的生片之间的金属糊形成的导电路径。 通孔从陶瓷体的外表面延伸到路径，以完成从包装外部到包装内部的电连接。 可以实现每英寸或更大的50路径的密度。 陶瓷体可以气密地密封在包装中的开口中，并且主体可以具有外围延伸部以便于馈送连接到包装上。
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公开(公告)号：US20070297137A1
公开(公告)日：2007-12-27
申请号：US11426435
申请日：2006-06-26
申请人： Timothy J. Glahn , Robert G. Kurtz
发明人： Timothy J. Glahn , Robert G. Kurtz
IPC分类号： H05K7/20
CPC分类号： H05K7/20636 , H05K7/1404 , H05K7/20454
摘要： A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein the bladder in an inflated state impresses the cooling module against an adjacent electronic circuit card. where the cooling module is forcibly pressed against adjacent electronic circuit card providing increased physical stability to the electronic circuit card as well as provide a cooling technique for the circuit card.
摘要翻译： 冷却模块包括导热板，设置在板的至少一侧的气囊，气囊具有腔室，以及设置在气囊腔室中的流体，其中处于膨胀状态的气囊使冷却模块抵靠相邻的 电子电路卡。 其中冷却模块被强制地压靠在相邻的电子电路卡上，为电子电路卡提供增加的物理稳定性，并为电路卡提供冷却技术。
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