公开(公告)号：US06521112B1

公开(公告)日：2003-02-18

申请号：US09743729

申请日：2001-01-12

申请人： Todd Alan Balisky

发明人： Todd Alan Balisky

IPC分类号： C25D2118

CPC分类号： C25D21/18 ,  G01N2035/00673 ,  Y10T436/12

摘要： A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition; establishing a pacing factor corresponding to a replenishment volume of a replenishment medium per unit of the replenishment condition; and defining a replenishment threshold corresponding to the product of a predetermined number of the defined units of the replenishment condition and the pacing factor. The rate of continued replenishment of the predetermined constituent of the chemical bath is determined in response to the replenishment condition, which may be elapsed time, ampere-hours (or coulombs), number of product loads, product surface area, or line speed over time. The method replenishes constituents as they actually are consumed. It also prevents depletion (or buildup in the case of decanting a by-product) and the associated time delay related to detection and correction. The method is effective in controlling a copper electroplating operation.

摘要翻译： 控制化学浴的含量的方法包括以下步骤：确定化学浴的补充条件; 定义补货条件的单位; 确定每单位补充条件对应于补充媒体的补充量的起搏因子; 并且定义对应于预定数量的所述补充条件和所述起搏因子的确定单元的乘积的补充阈值。 响应补充条件来确定化学浴的预定成分的持续补充率，其可以经过时间，安培小时（或库仑），产品负载数，产品表面积或线速度随时间变化 。 该方法在实际消费时补充成分。 它还可以防止消耗（或在滗析副产品的情况下积聚）以及与检测和校正相关的相关时间延迟。 该方法在控制铜电镀操作方面是有效的。

公开(公告)号：US07205153B2

公开(公告)日：2007-04-17

申请号：US10412484

申请日：2003-04-11

申请人： Todd Alan Balisky

发明人： Todd Alan Balisky

IPC分类号： G01N33/20 ,  G01N31/16

CPC分类号： G01N31/16 ,  Y10T436/11 ,  Y10T436/115831 ,  Y10T436/116664 ,  Y10T436/17

摘要： Embodiments of the invention provide an analytical method and analytical reagent solutions for determining the concentration of electrolyte components, such as copper, acid and chloride constituents in an acid or basic metal plating bath using a chemical analyzer. Common methods for measuring the concentration of copper general require two reagent solutions/two steps. This invention provides a novel analytical reagent solution that simplifies the chelating, buffering, and cleaning functions of separate regent solutions required for measuring electrolyte concentration. This has the benefits of reducing chemical inventory and associated dispensing equipment, and thus reducing chemical consumption.

摘要翻译： 本发明的实施方案提供了一种使用化学分析仪确定酸或碱性金属电镀浴中的电解质组分如铜，酸和氯组分的浓度的分析方法和分析试剂溶液。 通常测量铜浓度的方法需要两个试剂溶液/两个步骤。 本发明提供了一种新型的分析试剂溶液，其简化了测量电解质浓度所需的分离的试剂溶液的螯合，缓冲和清洁功能。 这具有减少化学品库存和相关配送设备的优点，从而减少化学品消耗。

公开(公告)号：US07147827B1

公开(公告)日：2006-12-12

申请号：US09674635

申请日：1999-04-30

申请人： Todd Alan Balisky

发明人： Todd Alan Balisky

IPC分类号： B32B5/02 ,  B01D21/24

CPC分类号： G05D21/02

摘要： A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containing a plating solution delivered from the mix container. A precision delivery arrangement delivers a precise predetermined quantum of a predetermined constituent of the plating solution to multiple mix containers and the hold containers. Transfer of plating solution between the mix and hold containers is effected by a transfer pump. Nitrogen gas that has been humidified with deionized water protects the plating solution from either acquiring water or becoming dehydrated, the humidified nitrogen gas being humidified to a predetermined relative humidity with respect to the temperature of the plating solution in the mix container. This is achieved by urging the nitrogen gas through a column that is at the same temperature as the plating solution. Precise delivery of the chemical constituents is achieved by a pneumatic pump arranged serially with an orifice and an inexpensive flow meter. The pneumatic pump is a positive displacement, double diaphragm pump.

摘要翻译： 用于控制电镀系统中具有预定化学成分的化学溶液的化学成分的化学控制系统，例如NiFe电镀系统，采用混合容器，用于容纳镀液和用于容纳从混合物中提供的电镀溶液的保持容器 容器。 精密传送装置将电镀溶液的预定成分的精确预定量传递给多个混合容器和保持容器。 在混合和保持容器之间转移电镀溶液由转移泵实现。 已经用去离子水加湿的氮气保护电镀液免于获得水或脱水，加湿的氮气相对于混合容器中的电镀液的温度被加湿至预定的相对湿度。 这是通过将氮气通过与电镀液相同温度的塔来实现的。 化学成分的精确输送是通过一个与孔和一个便宜的流量计串联布置的气动泵实现的。 气动泵是一个正排量双隔膜泵。

公开(公告)号：US06986835B2

公开(公告)日：2006-01-17

申请号：US10287901

申请日：2002-11-04

申请人： Todd Alan Balisky ,  Donald A. Cameron ,  Zhi-Wen Sun

发明人： Todd Alan Balisky ,  Donald A. Cameron ,  Zhi-Wen Sun

IPC分类号： G01N27/403

CPC分类号： G01N27/48

摘要： A method and apparatus for analyzing plating solutions. The apparatus generally includes a plating cell, a reference electrolyte input, one or more external additive pumps, and a process controller. In one embodiment, the plating cell includes a cavity therein having a larger volumetric portion adjacent a smaller volumetric portion adapted to hold one or more solutions therein. The plating cell also includes a base disposed adjacent the bottom of the plating cell and adapted to receive and mix one or more test solutions as part of the plating solution analysis. In one configuration, the base includes electrical ports adapted to connect stimulation signals to a working electrode, counter electrode, and reference electrode disposed within the cell. The base also includes a thermal sensor in thermal contact with test solutions contained within the vessel.

摘要翻译： 一种用于分析电镀液的方法和装置。 该设备通常包括电镀槽，参考电解质输入，一个或多个外部添加剂泵以及过程控制器。 在一个实施例中，电镀单元包括其中具有较大体积部分的空腔，该体积部分邻近适于在其中容纳一种或多种溶液的较小体积部分。 电镀单元还包括邻近电镀单元的底部设置的底座，并且适合于接收和混合作为电镀溶液分析的一部分的一种或多种测试溶液。 在一种配置中，底座包括适于将刺激信号连接到设置在电池内的工作电极，对电极和参考电极的电气端口。 该基座还包括与容器内容纳的测试溶液热接触的热传感器。