公开(公告)号：US06527934B1

公开(公告)日：2003-03-04

申请号：US09703113

申请日：2000-10-31

申请人： Michael A. Steward

发明人： Michael A. Steward

IPC分类号： C25D2118

CPC分类号： C25D21/14 ,  C25D21/18

摘要： A process is provided for electrolytically depositing copper onto a workpiece. The process includes the steps of providing a copper generation vessel and generating a copper plating solution from solid-state copper in the vessel. The plating solution so generated is continuously circulated between the copper generation vessel and a plating vessel. An insoluble, dimensionally stable anode is provided in the plating vessel in contact with the plating solution. The workpiece is immersed in the plating solution in the plating vessel in close proximity to the anode. Electric current is passed through the plating solution between the anode and the workpiece to be plated so that the workpiece acts as a cathode in an electrolytic circuit and copper ions are electrolytically deposited on the workpiece. The process ensures that the workpiece is positioned relative to the anode so that all surfaces to be plated are exposed to the anode surface.

摘要翻译： 提供了将铜电解沉积到工件上的工艺。 该方法包括提供铜产生容器并从容器中的固态铜产生镀铜溶液的步骤。 所产生的电镀液在铜发生容器和电镀槽之间连续循环。 在电镀容器中提供与电镀溶液接触的不溶性的尺寸稳定的阳极。 将工件浸在电镀槽中的电镀液中，并且靠近阳极。 电流通过阳极和要被电镀的工件之间的电镀溶液，使得工件在电解电路中用作阴极，铜离子被电解沉积在工件上。 该过程确保工件相对于阳极定位，使得要镀覆的所有表面暴露于阳极表面。

公开(公告)号：US06306275B1

公开(公告)日：2001-10-23

申请号：US09540226

申请日：2000-03-31

申请人： Lawrence P. Donovan, III ,  Roger J. Timmer ,  David P. Hartrick

发明人： Lawrence P. Donovan, III ,  Roger J. Timmer ,  David P. Hartrick

IPC分类号： C25D2118

CPC分类号： C25D21/18 ,  C25D3/12

摘要： A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.

摘要翻译： 使用用于控制镀镍电解质中的烯化氧分散体的胶束尺寸分布的方法来将电解质保持在适于生产具有均匀缎面光洁度的镍涂层的条件下，其中粗糙度深度的整理特性保持在期望的范围内 限制 该方法包括从电镀浴中除去一部分电解质的步骤，从电镀浴中除去的电解质中过滤环氧烷，将氧化烯加入到电镀浴中，并将经过滤的电解液返回到电镀浴中。 该方法从电解质中除去较大的环氧烷胶束，并用较小的胶束代替它们以维持所需的胶束尺寸分布。

公开(公告)号：US06638409B1

公开(公告)日：2003-10-28

申请号：US10152471

申请日：2002-05-21

申请人： Chen-Ming Huang ,  Li-Chuen Cheng ,  Hung-Jen Lin ,  Chih-Chen Ku ,  San-Sun Yang

发明人： Chen-Ming Huang ,  Li-Chuen Cheng ,  Hung-Jen Lin ,  Chih-Chen Ku ,  San-Sun Yang

IPC分类号： C25D2118

CPC分类号： C25D21/06 ,  C25D21/12 ,  C25D21/18

摘要： A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.

摘要翻译： 实时和在线过程控制系统通过使用实时在线可编程控制器在铜电化学电镀IC器件中保持稳定的电镀性能。 两个或更多个阀将电解液从电镀池引导回储存器，连接另一个碳过滤器以及微过滤器。 可编程控制器控制至少两个直列阀的操作以引导系统内的电解质的流动。

公开(公告)号：US06350362B1

公开(公告)日：2002-02-26

申请号：US09485786

申请日：2000-03-28

申请人： Jens-Eric Geisler ,  Ralf-Peter Wachter ,  Lorenz Kopp ,  Manfred Maurer

发明人： Jens-Eric Geisler ,  Ralf-Peter Wachter ,  Lorenz Kopp ,  Manfred Maurer

IPC分类号： C25D2118

CPC分类号： C25D21/14 ,  H05K3/241

摘要： A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally contains compounds of an electrochemically reversible redox system. With the oxidized form of said system, metal is dissolved in an ion generator 1, traversed by the fluid, so that these compounds are thereby reduced. For the deposition of metal, the dissolved metal ions on the item to be treated are reduced. The compounds of the redox system in the reduced form are oxidized again on the insoluble anodes in the electroplating system 13. In order to keep the concentration of the metal ions in the electrolytic fluid constant, at least a portion of the electrolytic fluid, contained in the electroplating system, is conducted through one or a plurality of electrolytic auxiliary cells 6.

摘要翻译： 描述了一种用于调节电解液中金属离子浓度的方法和装置，其用于沉积具有不溶性阳极的金属，并且还包含电化学可逆氧化还原体系的化合物。 利用所述系统的氧化形式，将金属溶解在离子发生器1中，由流体穿过，从而减少这些化合物。 为了沉积金属，待处理物品上溶解的金属离子减少。 还原形式的氧化还原体系的化合物在电镀系统13中的不溶性阳极上再次被氧化。为了保持电解液中金属离子的浓度恒定，至少包含一部分电解液 电镀系统通过一个或多个电解辅助电池6传导。

公开(公告)号：US06207033B1

公开(公告)日：2001-03-27

申请号：US09306289

申请日：1999-05-06

申请人： Mark D. Miller ,  Joseph F. Cox ,  Steven Langston

发明人： Mark D. Miller ,  Joseph F. Cox ,  Steven Langston

IPC分类号： C25D2118

CPC分类号： C25D21/18 ,  Y10S204/13

摘要： A process for the regeneration of a plating bath comprising trivalent chromium involves the use of platinum anode and a copper cathode wherein the anode to cathode ratio is greater than 2:1 upon passage of a charge having a current density of at least 10 Amperes/diameter2 of exposed cathode. An apparatus for conducting the process is also disclosed. The described process obviates the need for an ion exchange resin and is conducted without the formation of any deleterious toxic sludge.

摘要翻译： 用于再生包含三价铬的电镀浴的方法包括使用铂阳极和铜阴极，其中当电流密度为至少10安培/直径2的电荷时，阳极与阴极之比大于2:1 的暴露阴极。 还公开了一种用于进行该过程的装置。 所描述的方法消除了对离子交换树脂的需要，并且在不形成任何有害的有毒污泥的情况下进行。

公开(公告)号：US06793795B1

公开(公告)日：2004-09-21

申请号：US09831763

申请日：2001-05-11

申请人： Heinrich Meyer ,  Andreas Thies

发明人： Heinrich Meyer ,  Andreas Thies

IPC分类号： C25D2118

CPC分类号： H01L21/76877 ,  H01L21/2885

摘要： A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer. The electrolytic metal deposition method is accomplished by bringing the semiconductor substrates into contact with a copper deposition bath containing at least one copper ion source, at least one additive compound for controlling the physico-mechanical properties of the copper layers, and Fe(II) and/or Fe(III) compounds, and applying an electric voltage between the semiconductor substrates and dimensionally stable counter-electrodes.

摘要翻译： 公开了一种用于在制造集成电路时从半导体衬底的表面上的高纯度铜电解形成导体结构的方法，该表面设置有凹部。 该方法包括以下步骤：用全表面碱性金属层涂覆半导体衬底的表面，以便为电解沉积获得足够的电导，通过在基本金属层上沉积具有均匀层厚度的铜层的全表面沉积 电解金属沉积法，构成铜层。 电解金属沉积方法是通过使半导体衬底与含有至少一种铜离子源的铜沉积浴，至少一种用于控制铜层的物理机械性能的添加剂化合物和Fe（II）和 /或Fe（III）化合物，并且在半导体衬底和尺寸稳定的对电极之间施加电压。

公开(公告)号：US06596148B1

公开(公告)日：2003-07-22

申请号：US09651016

申请日：2000-08-30

申请人： Brett Matthew Belongia ,  Zhen Wu Lin ,  John E. Pillion ,  Jieh-Hwa Shyu

发明人： Brett Matthew Belongia ,  Zhen Wu Lin ,  John E. Pillion ,  Jieh-Hwa Shyu

IPC分类号： C25D2118

CPC分类号： C25D21/18 ,  C25D21/22 ,  Y02W10/37 ,  Y10S204/13

摘要： The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass and the endpoint of the oxidative process detected by a sensor. Residual organics, if desired, and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

摘要翻译： 本发明提供一种用于从电镀液中选择性地除去一种或多种有机的，也优选一种或多种无机污染物的系统和方法。 更具体地说，本发明的方法涉及与化学氧化剂组合使用能量源，单独或与催化剂结合使氧化电镀槽中的有机污染物的水平达到使电镀浴能够在 适当的化学调整。 氧化处理方法可以是在单次通过中进行的连续方法或分批方法，并且由传感器检测氧化过程的终点。 通过化学吸附或物理吸附处理从溶液中除去残留的有机物，如果需要，以及浴中的氯离子。 通过选择性离子交换树脂或电渗析从电镀浴中除去无机污染物，同时通过过滤除去颗粒和悬浮胶体颗粒，然后再处理处理后的镀液。

公开(公告)号：US06251251B1

公开(公告)日：2001-06-26

申请号：US09192431

申请日：1998-11-16

申请人： Cyprian E. Uzoh ,  Panayotis C. Andricacos ,  John Owen Dukovic ,  Robert P. Westerfield, Jr.

发明人： Cyprian E. Uzoh ,  Panayotis C. Andricacos ,  John Owen Dukovic ,  Robert P. Westerfield, Jr.

IPC分类号： C25D2118

CPC分类号： C25D7/12 ,  C25D17/001 ,  C25D17/12

摘要： An anode assembly including a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface.

摘要翻译： 包括穿孔阳极的阳极组件。 穿孔阳极支架固定阳极。 阳极保持器至少在底壁中具有穿孔，使得电镀溶液可以流过阳极保持器中的穿孔和阳极中的穿孔。 阳极隔离器分离阳极和阴极。 阳极隔离器包括至少一个曲线表面。

公开(公告)号：US06616827B2

公开(公告)日：2003-09-09

申请号：US09838321

申请日：2001-04-20

申请人： Kazuyoshi Nabekura ,  Yutaka Hirasawa ,  Naotomi Takahashi

发明人： Kazuyoshi Nabekura ,  Yutaka Hirasawa ,  Naotomi Takahashi

IPC分类号： C25D2118

CPC分类号： B01D37/02

摘要： The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a filtration method of copper electrolyte for removing electrolytic by-products and dirt which affect copper electrolysis, by passing copper electrolyte through a filter element precoated with a filtering aid, in the present invention, a precoated layer of a filtering aid is formed on a filter element in advance. Activated carbon preliminary treatment solution containing powdery activated carbon is passed through the filter element formed with the precoated layer, and is also circulated until no powdery activated carbon leaks from an outlet of the filter element, thus forming a powdery activated carbon layer on the precoated layer. Subsequently, the copper electrolyte is passed through for filtration.

摘要翻译： 本发明提供了一种铜电解质的过滤方法，其可以通过改进所谓的预涂法的常规过滤方法来去除微小的电解副产物和污垢并且可以提高过滤效率。 在用于除去影响铜电解的电解副产物和污垢的铜电解质的过滤方法中，通过使铜电解质通过预过滤助剂的过滤元件通过，在本发明中，过滤助剂的预涂层形成在 过滤元件。 含有粉末状活性炭的活性炭预处理溶液通过由预涂层形成的过滤元件，并且循环，直到粉状活性炭从过滤元件的出口泄漏出来，从而在预涂层上形成粉状活性炭层 。 随后，使铜电解液通过以进行过滤。

公开(公告)号：US06521112B1

公开(公告)日：2003-02-18

申请号：US09743729

申请日：2001-01-12

申请人： Todd Alan Balisky

发明人： Todd Alan Balisky

IPC分类号： C25D2118

CPC分类号： C25D21/18 ,  G01N2035/00673 ,  Y10T436/12

摘要： A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition; establishing a pacing factor corresponding to a replenishment volume of a replenishment medium per unit of the replenishment condition; and defining a replenishment threshold corresponding to the product of a predetermined number of the defined units of the replenishment condition and the pacing factor. The rate of continued replenishment of the predetermined constituent of the chemical bath is determined in response to the replenishment condition, which may be elapsed time, ampere-hours (or coulombs), number of product loads, product surface area, or line speed over time. The method replenishes constituents as they actually are consumed. It also prevents depletion (or buildup in the case of decanting a by-product) and the associated time delay related to detection and correction. The method is effective in controlling a copper electroplating operation.

摘要翻译： 控制化学浴的含量的方法包括以下步骤：确定化学浴的补充条件; 定义补货条件的单位; 确定每单位补充条件对应于补充媒体的补充量的起搏因子; 并且定义对应于预定数量的所述补充条件和所述起搏因子的确定单元的乘积的补充阈值。 响应补充条件来确定化学浴的预定成分的持续补充率，其可以经过时间，安培小时（或库仑），产品负载数，产品表面积或线速度随时间变化 。 该方法在实际消费时补充成分。 它还可以防止消耗（或在滗析副产品的情况下积聚）以及与检测和校正相关的相关时间延迟。 该方法在控制铜电镀操作方面是有效的。