公开(公告)号：US20250125175A1

公开(公告)日：2025-04-17

申请号：US18914666

申请日：2024-10-14

Applicant: Tokyo Electron Limited

Inventor： Seiji Nakashima ,  Tsuyoshi Watanabe ,  Akira Oozono ,  Suguru Enokida

IPC: H01L21/677 ,  H01L21/67

Abstract: A substrate processing apparatus includes a carry-in/out block having a container placement section; and a processing block, disposed to be adjacent to the carry-in/out block in a width direction, having multiple processing modules each configured to perform a process on a substrate. The carry-in/out block further includes: a transit block in which transit modules are provided on a processing block side to deliver the substrate to/from the processing block; and a first transfer mechanism configured to transfer the substrate between the container placement section and the transit block. The processing block further includes a second transfer mechanism configured to transfer the substrate between the transit block and the processing module. The first transfer mechanism has a support, and is configured to allow the substrate supported by the support to pass through the transit block in a depth direction intersecting with the width direction, when viewed from a top.