公开(公告)号：US11199785B2

公开(公告)日：2021-12-14

申请号：US17030735

申请日：2020-09-24

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Hiroki Sato ,  Ippei Hamada

IPC: G03F7/20 ,  H01L21/67 ,  G03F7/16

Abstract: An apparatus includes: a treatment block including treatment modules; and a relay block coupling the treatment block and an exposure apparatus in a width direction, and including a transfer-in/out mechanism for the exposure apparatus. In the treatment block being multilayered in an up-down direction, a transfer mechanism is provided in a transfer region extending in the width direction. In a layer, in the treatment block, at a position accessible from the transfer-in/out mechanism, a deliverer on which the substrate is mounted when the substrate is delivered between the blocks is provided at an end on the relay block side. Pre-exposure storages storing the substrate before the exposure are provided along the width direction in two regions between which the transfer region is interposed in a depth direction. A non-treatment unit is provided at a portion where the pre-exposure storages are not provided in the two regions.

公开(公告)号：US20250125175A1

公开(公告)日：2025-04-17

申请号：US18914666

申请日：2024-10-14

Applicant: Tokyo Electron Limited

Inventor： Seiji Nakashima ,  Tsuyoshi Watanabe ,  Akira Oozono ,  Suguru Enokida

IPC: H01L21/677 ,  H01L21/67

Abstract: A substrate processing apparatus includes a carry-in/out block having a container placement section; and a processing block, disposed to be adjacent to the carry-in/out block in a width direction, having multiple processing modules each configured to perform a process on a substrate. The carry-in/out block further includes: a transit block in which transit modules are provided on a processing block side to deliver the substrate to/from the processing block; and a first transfer mechanism configured to transfer the substrate between the container placement section and the transit block. The processing block further includes a second transfer mechanism configured to transfer the substrate between the transit block and the processing module. The first transfer mechanism has a support, and is configured to allow the substrate supported by the support to pass through the transit block in a depth direction intersecting with the width direction, when viewed from a top.

公开(公告)号：US20130166064A1

公开(公告)日：2013-06-27

申请号：US13716659

申请日：2012-12-17

Applicant: Tokyo Electron Limited

Inventor： Junnosuke Maki ,  Mitsuteru Yano ,  Seiji Nakano ,  Tsuyoshi Watanabe ,  Yasunori Toyoda ,  Suguru Enokida ,  Naruaki Iida ,  Hiroki Harada

IPC: G06F17/00

CPC classification number: G06F17/00 ,  B25J13/085 ,  H01L21/67288 ,  H01L21/68707

Abstract: A transfer apparatus for mounting and transferring a transferred component on a driven means, the transfer apparatus includes: a driving means for rotating a driving side pulley by a rotational driving force of a motor to move a belt wound around the driving side pulley, thereby moving the driven means coupled to the belt in a predetermined direction; and a transfer monitoring means for monitoring a transfer state of the driven means, wherein the transfer monitoring means detects a torque value of the motor required to move the driven means, calculates a torque differential value of the torque value with respect to time based on the detected torque value, and detects the transfer state using the calculated torque differential value.

Abstract translation: 一种用于在被驱动装置上安装和传送传送部件的传送装置，所述传送装置包括：驱动装置，用于通过电动机的旋转驱动力旋转驱动侧滑轮，以使缠绕在驱动侧滑轮周围的皮带移动，从而移动 所述被驱动装置沿预定方向联接到所述带; 以及传送监视装置，用于监视被驱动装置的传送状态，其中转印监视装置检测移动被驱动装置所需的电动机的转矩值，基于时间计算转矩值相对于时间的转矩差值 检测转矩值，并使用计算出的转矩差分值来检测转印状态。

公开(公告)号：US12198961B2

公开(公告)日：2025-01-14

申请号：US18388550

申请日：2023-11-10

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20240231232A1

公开(公告)日：2024-07-11

申请号：US18617960

申请日：2024-03-27

Applicant: Tokyo Electron Limited

Inventor： Yoji Sakata ,  Masashi Tsuchiyama ,  Tsuyoshi Watanabe

IPC: G03F7/16 ,  H01L21/67 ,  H01L21/677

CPC classification number: G03F7/162 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67745

Abstract: A substrate processing apparatus includes a first unit block including a first substrate transfer region, a first and a second processing modules provided to face a first and a second sides of the first substrate transfer region in a left-right direction, and a first and a second transfer mechanisms provided at the first and the second sides and configured to deliver a substrate to the first and the second processing modules; a second unit block, stacked on the first unit block, including a second substrate transfer region and a third transfer mechanism; a substrate carry-in/out block provided at a first side of a stack of the unit blocks and configured to deliver the substrate to the first and the third transfer mechanisms; a relay block provided at a second side of the stack and configured to deliver the substrate to the second and the third transfer mechanisms.

公开(公告)号：US11971661B2

公开(公告)日：2024-04-30

申请号：US17192087

申请日：2021-03-04

Applicant: Tokyo Electron Limited

Inventor： Yoji Sakata ,  Masashi Tsuchiyama ,  Tsuyoshi Watanabe

IPC: G03F7/16 ,  H01L21/67 ,  H01L21/677

CPC classification number: G03F7/162 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67745

Abstract: A substrate processing apparatus includes a first unit block including a first substrate transfer region, a first and a second processing modules provided to face a first and a second sides of the first substrate transfer region in a left-right direction, and a first and a second transfer mechanisms provided at the first and the second sides and configured to deliver a substrate to the first and the second processing modules; a second unit block, stacked on the first unit block, including a second substrate transfer region and a third transfer mechanism; a substrate carry-in/out block provided at a first side of a stack of the unit blocks and configured to deliver the substrate to the first and the third transfer mechanisms; a relay block provided at a second side of the stack and configured to deliver the substrate to the second and the third transfer mechanisms.

公开(公告)号：US20210278768A1

公开(公告)日：2021-09-09

申请号：US17192087

申请日：2021-03-04

Applicant: Tokyo Electron Limited

Inventor： Yoji Sakata ,  Masashi Tsuchiyama ,  Tsuyoshi Watanabe

IPC: G03F7/16

Abstract: A substrate processing apparatus includes a first unit block including a first substrate transfer region, a first and a second processing modules provided to face a first and a second sides of the first substrate transfer region in a left-right direction, and a first and a second transfer mechanisms provided at the first and the second sides and configured to deliver a substrate to the first and the second processing modules; a second unit block, stacked on the first unit block, including a second substrate transfer region and a third transfer mechanism; a substrate carry-in/out block provided at a first side of a stack of the unit blocks and configured to deliver the substrate to the first and the third transfer mechanisms; a relay block provided at a second side of the stack and configured to deliver the substrate to the second and the third transfer mechanisms.

公开(公告)号：US11079691B2

公开(公告)日：2021-08-03

申请号：US17030810

申请日：2020-09-24

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Hiroki Sato ,  Ippei Hamada

IPC: G03F7/20 ,  H01L21/677 ,  G03F7/16 ,  H01L21/67

Abstract: An apparatus includes: a treatment block; and a relay block including a first transfer-in/out module for an exposure apparatus. In the treatment block, a treatment module is provided in each layer, and a deliverer is provided at an end on the relay block side in the layer including a pre-exposure treatment module. In the relay block, a second transfer-in/out module for the deliverer and a post-exposure treatment module is provided in a region adjacent, in the width direction, to the deliverer, the first transfer-in/out module is provided in a relay side transfer region extending in a depth direction from a region overlapping with the second transfer-in/out module, the post-exposure treatment module is provided in a region adjacent, in an up-down direction, to the relay side transfer region and adjacent, in the depth direction, to the second transfer-in/out module, and a relay mechanism is provided.

公开(公告)号：US11869789B2

公开(公告)日：2024-01-09

申请号：US17533672

申请日：2021-11-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  G03F7/16

CPC classification number: H01L21/67712 ,  G03F7/168 ,  H01L21/67766

Abstract: A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US11664254B2

公开(公告)日：2023-05-30

申请号：US17530581

申请日：2021-11-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  H01L21/67 ,  G03F7/16 ,  H01L21/683

CPC classification number: H01L21/67712 ,  G03F7/16 ,  H01L21/6719 ,  H01L21/67715 ,  H01L21/6838

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.