公开(公告)号：US20230081958A1

公开(公告)日：2023-03-16

申请号：US17944469

申请日：2022-09-14

Applicant: Tokyo Electron Limited

Inventor： Koji SASAKI ,  Katsuyuki HIGASHI ,  Yuji SESHIMO

IPC: C23C16/44 ,  C23C16/52 ,  C23C16/40 ,  C23C16/455

Abstract: A substrate processing method performed by a substrate processing apparatus including: a processing container that processes a substrate; a gas supply that supplies a gas into the processing container; an exhaust device that exhausts a gas from an inside of the processing container; and a gas analyzer that analyzes the gas passing through an exhaust pipe that connects the processing container and the exhaust device. The method includes: performing a processing with a processing gas in the processing container by supplying the processing gas into the processing container; purging the processing gas in the processing container by supplying a purge gas into the processing container; analyzing the processing gas passing through the exhaust pipe by the gas analyzer during the purging the processing gas; and determining a condition of the purging the processing gas based on a result of analyzing the processing gas.

公开(公告)号：US20230096797A1

公开(公告)日：2023-03-30

申请号：US17944625

申请日：2022-09-14

Applicant: Tokyo Electron Limited

Inventor： Koji SASAKI ,  Yuji SESHIMO ,  Katsuyuki HIGASHI

IPC: C23C16/448 ,  C23C16/52

Abstract: A gas management method includes: heating a raw material container that accommodates a raw material, by a heater, thereby generating a vaporized raw material gas; supplying the vaporized raw material gas together with a carrier gas to a processing container that accommodates a substrate, thereby performing a processing on the substrate; and controlling the heater based on a weight of the substrate after the processing on the substrate.