PLASMA PROCESSING APPARATUS AND CLEANING METHOD

    公开(公告)号:US20240120185A1

    公开(公告)日:2024-04-11

    申请号:US18544468

    申请日:2023-12-19

    发明人: Kazuki TSUCHIYA

    IPC分类号: H01J37/32

    摘要: The chamber is internally provided with a stage on which a substrate is disposed, and an exhaust port connected to an exhaust system around the stage. The baffle is provided around the stage, and divides a space in the chamber into a processing space where plasma processing is performed on the substrate, and an exhaust space connected to the exhaust port. The switching mechanism switches the baffle between a shield state in which the baffle shields a plasma and a transmissive state in which the baffle allows a plasma to pass therethrough. The controller controls the switching mechanism to switch the baffle from the shield state to the transmissive state or from the transmissive state to the shield state.