公开(公告)号：US20180286718A1

公开(公告)日：2018-10-04

申请号：US15940036

申请日：2018-03-29

Applicant: Tokyo Electron Limited

Inventor： Teruaki Konishi ,  Kazusige Sano ,  Koji Tanaka

IPC: H01L21/67 ,  G01N5/00

Abstract: A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus A1 includes a storage line 61 configured to store a processing liquid therein; an introduction line 62 configured to introduce the processing liquid into the storage line 61; a discharge line 63 configured to discharge the processing liquid from the storage line 61; and a gas supply unit 65 configured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line 61.

公开(公告)号：US11152234B2

公开(公告)日：2021-10-19

申请号：US15940036

申请日：2018-03-29

Applicant: Tokyo Electron Limited

Inventor： Teruaki Konishi ,  Kazusige Sano ,  Koji Tanaka

IPC: H01L21/67 ,  G01N5/00 ,  G01F11/00 ,  H01L21/677 ,  G01G5/00 ,  G01F11/28

Abstract: A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus A1 includes a storage line 61 configured to store a processing liquid therein; an introduction line 62 configured to introduce the processing liquid into the storage line 61; a discharge line 63 configured to discharge the processing liquid from the storage line 61; and a gas supply unit 65 configured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line 61.