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公开(公告)号:US20200096321A1
公开(公告)日:2020-03-26
申请号:US16578591
申请日:2019-09-23
Applicant: Tokyo Electron Limited
Inventor: Kazuya Hisano , Akiko Kiyotomi , Yasuaki Noda , Keisuke Hamamoto , Tadashi Nishiyama
Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.
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公开(公告)号:US20190096730A1
公开(公告)日:2019-03-28
申请号:US16137728
申请日:2018-09-21
Applicant: Tokyo Electron Limited
Inventor: Satoshi Morita , Ryoji Ikebe , Yasuaki Noda , Norihisa Koga , Keisuke Hamamoto , Masato Hosaka
IPC: H01L21/68 , H01L23/544 , B65G21/10 , G06T7/00
Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.
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公开(公告)号:US11378388B2
公开(公告)日:2022-07-05
申请号:US16578591
申请日:2019-09-23
Applicant: Tokyo Electron Limited
Inventor: Kazuya Hisano , Akiko Kiyotomi , Yasuaki Noda , Keisuke Hamamoto , Tadashi Nishiyama
Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.
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公开(公告)号:US10707109B2
公开(公告)日:2020-07-07
申请号:US16137728
申请日:2018-09-21
Applicant: Tokyo Electron Limited
Inventor: Satoshi Morita , Ryoji Ikebe , Yasuaki Noda , Norihisa Koga , Keisuke Hamamoto , Masato Hosaka
IPC: H01L21/67 , H01L21/68 , B65G21/10 , H01L23/544 , G06T7/00 , H01L21/687
Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.
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