公开(公告)号：US20130334172A1

公开(公告)日：2013-12-19

申请号：US13677534

申请日：2012-11-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。

公开(公告)号：US11094568B2

公开(公告)日：2021-08-17

申请号：US15960800

申请日：2018-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Nakamizo ,  Satoshi Morita ,  Akinori Tanaka ,  Hiroshi Komiya ,  Mikio Nakashima ,  Kousuke Fukuda ,  Youichi Masaki ,  Ryoji Ando ,  Ikuo Sunaka

IPC: H01L21/67 ,  G01F9/00 ,  G01M3/28 ,  G01F25/00 ,  G05B23/02 ,  G01F15/00

Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.

公开(公告)号：US11011436B2

公开(公告)日：2021-05-18

申请号：US15454269

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/66 ,  H01L21/67

Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

公开(公告)号：US10128137B2

公开(公告)日：2018-11-13

申请号：US15454346

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US11862489B2

公开(公告)日：2024-01-02

申请号：US17063828

申请日：2020-10-06

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Kouzou Kawahara

IPC: H01L21/67 ,  H01L21/687 ,  H05B6/10

CPC classification number: H01L21/67103 ,  H01L21/68785 ,  H05B6/10 ,  H01L21/67023

Abstract: A substrate processing apparatus includes: a rotary stage configured to hold a substrate; a rotary driver configured to rotate the rotary stage around a rotation axis; at least one electric heater installed in the rotary stage; at least one power receiving coil installed in the rotary stage and electrically connected to the electric heater; at least one power feeding coil installed to face the power receiving coil in a direction of the rotation axis with a gap between the power feeding coil and the power receiving coil; and a radio-frequency power supply unit configured to supply radio-frequency power to the power feeding coil.

公开(公告)号：US20210257236A1

公开(公告)日：2021-08-19

申请号：US17242709

申请日：2021-04-28

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US20190096730A1

公开(公告)日：2019-03-28

申请号：US16137728

申请日：2018-09-21

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Ryoji Ikebe ,  Yasuaki Noda ,  Norihisa Koga ,  Keisuke Hamamoto ,  Masato Hosaka

IPC: H01L21/68 ,  H01L23/544 ,  B65G21/10 ,  G06T7/00

Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.

公开(公告)号：US20170287704A1

公开(公告)日：2017-10-05

申请号：US15454269

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/02 ,  H01L21/66 ,  G05B19/402 ,  H01L21/67

CPC classification number: H01L22/20 ,  G05B2219/45031 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L22/12

Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

公开(公告)号：US09039863B2

公开(公告)日：2015-05-26

申请号：US13677534

申请日：2012-11-15

Applicant: Tokyo Electron Limited

Inventor： Shuhei Matsumoto ,  Shuji Iwanaga ,  Hiroshi Tomita ,  Kenji Nakamizo ,  Satoshi Morita

IPC: C23F1/00 ,  H01L21/67 ,  G05D3/00

CPC classification number: H01L21/67023 ,  G05D3/00 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67259

Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.

Abstract translation: 公开了一种能够在不受例如基板的材料或表面状况的影响的情况下精确地确定基板的保持状态的液体处理装置。 液体处理装置包括：保持基板的基板保持单元，当基板被基板保持单元适当地保持时拍摄基板周边部分存在的区域的照相机;以及控制单元，其确定基板保持单元的保持状态 所述基板由所述基板保持单元基于由所述照相机拍摄的图像保持。

公开(公告)号：US11637035B2

公开(公告)日：2023-04-25

申请号：US16583590

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Masami Akimoto ,  Katsuhiro Morikawa ,  Kouichi Mizunaga

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/304 ,  B08B3/04 ,  H01L21/02

Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.