公开(公告)号：US20240395589A1

公开(公告)日：2024-11-28

申请号：US18672505

申请日：2024-05-23

Applicant: Tokyo Electron Limited

Inventor： Shota UMEZAKI ,  Kouji KIMOTO ,  Masato OZEKI ,  Ryosuke KENZAKI

IPC: H01L21/677 ,  B23Q7/10 ,  B23Q7/14 ,  H01L21/67

Abstract: A substrate processing apparatus includes a process mechanism that processes a substrate. The process mechanism includes: a processing container that accommodates therein the substrate; a first supporting member that horizontally supports the substrate; and a second supporting member that horizontally supports the substrate at an outside of the processing container. The first supporting member and the second supporting member support the substrate such that a center axis of the substrate in the processing container and a center axis of the substrate at an outside of the processing container match, in a case where at least viewed from a direction where the substrate is carried-in to the container and carried-out from the container.