公开(公告)号：US20230063907A1

公开(公告)日：2023-03-02

申请号：US18048102

申请日：2022-10-20

Applicant: Tokyo Electron Limited

Inventor： Kyoko IKEDA ,  Kazuya DOBASHI ,  Tsunenaga NAKASHIMA ,  Kenji SEKIGUCHI ,  Shuuichi NISHIKIDO ,  Masato NAKAJO ,  Takahiro YASUTAKE

IPC: B08B5/02

Abstract: A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

公开(公告)号：US20220001426A1

公开(公告)日：2022-01-06

申请号：US17295971

申请日：2019-11-20

Applicant: Tokyo Electron Limited

Inventor： Kyoko IKEDA ,  Kazuya DOBASHI ,  Tsunenaga NAKASHIMA ,  Kenji SEKIGUCHI ,  Shuuichi NISHIKIDO ,  Masato NAKAJO ,  Takahiro YASUTAKE

IPC: B08B5/02

Abstract: A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.