公开(公告)号：US20210082750A1

公开(公告)日：2021-03-18

申请号：US17021586

申请日：2020-09-15

Applicant: Tokyo Electron Limited

Inventor： Kai-Hung YU ,  Jodi GRZESKOWIAK ,  Nicholas JOY ,  Jeffrey SMITH

IPC: H01L21/768

Abstract: A method of metallization includes receiving a substrate having a recess formed therein. The recess has a bottom and sidewalls, and a conformal liner is deposited on the bottom and sidewalls of the recess. The conformal liner is removed from an upper portion of the recess to expose upper sidewalls of the recess while leaving the conformal liner in a lower portion of the recess covering the bottom and lower sidewalls of the recess. Metal is deposited in a lower portion of the recess to form a metallization feature including the conformal liner in the lower portion of the recess and the metal.