公开(公告)号：US20250054809A1

公开(公告)日：2025-02-13

申请号：US18366492

申请日：2023-08-07

Applicant: Tokyo Electron Limited

Inventor： Kandabara Tapily ,  Subhadeep Kal ,  Peng Wang ,  Peter Biolsi

IPC: H01L21/768 ,  H01L21/311

Abstract: A method of processing a substrate that includes: forming a pattern of an electrically conductive layer over the substrate, the electrically conductive layer and a first dielectric layer being exposed at a surface of the substrate; selectively depositing a graphene layer over the electrically conductive layer relative to the first dielectric layer; selectively depositing a second dielectric layer over the first dielectric layer relative to the graphene layer; and depositing a third dielectric layer over the substrate, the third dielectric layer covering the second dielectric layer and the graphene layer.