Substrate liquid processing apparatus and liquid discharge evaluation method

    公开(公告)号:US12269052B2

    公开(公告)日:2025-04-08

    申请号:US17179551

    申请日:2021-02-19

    Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

    SUBSTRATE LIQUID PROCESSING APPARATUS AND LIQUID DISCHARGE EVALUATION METHOD

    公开(公告)号:US20210260612A1

    公开(公告)日:2021-08-26

    申请号:US17179551

    申请日:2021-02-19

    Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

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