公开(公告)号：US10685858B2

公开(公告)日：2020-06-16

申请号：US16019773

申请日：2018-06-27

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Higashi ,  Takahisa Otsuka ,  Kazuyoshi Shinohara ,  Takashi Nakazawa ,  Seiya Fujimoto ,  Yuichi Douki

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/306

Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.

公开(公告)号：US20210260612A1

公开(公告)日：2021-08-26

申请号：US17179551

申请日：2021-02-19

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Yuichi Douki ,  Akinori Tanaka ,  Minoru Tashiro ,  Reo Kitayama ,  Shu Yamamoto

IPC: B05B12/12 ,  B05B12/10 ,  B05B3/16 ,  B05D1/02

Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

公开(公告)号：US10261521B2

公开(公告)日：2019-04-16

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G06F19/00 ,  G05D7/06 ,  H01L21/67

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

公开(公告)号：US10256127B2

公开(公告)日：2019-04-09

申请号：US15278155

申请日：2016-09-28

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Yuichi Douki ,  Hiromitsu Maejima

IPC: G05D3/12 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  G05B19/418

Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.

公开(公告)号：US20160368114A1

公开(公告)日：2016-12-22

申请号：US15181527

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

Abstract translation: 公开了一种处理装置，其包括容纳工件的室，设置在室内的喷嘴，测量供给到喷嘴的处理流体的供给流量的测量单元，执行流路开闭的打开/关闭单元 的处理流体，以及控制器。 控制器根据指示处理内容的配方信息发送打开/关闭操作信号，该打开/关闭操作信号使打开/关闭单元执行打开/关闭操作。 根据配方信息向打开/关闭单元发送打开/关闭操作信号后，控制器基于测量单元的测量结果开始积分供给流量，基于以下方式监视供给流量的上升 计算的积分量，以及当提供特定流量时，基于由测量单元实际测量的值监视供给流量。

公开(公告)号：US09507349B2

公开(公告)日：2016-11-29

申请号：US13752440

申请日：2013-01-29

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Yuichi Douki ,  Hiromitsu Maejima

IPC: G05D3/12 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67259 ,  G05B19/4189 ,  G05B2219/45032 ,  G05B2219/45051 ,  G05D3/125 ,  H01L21/67742 ,  H01L21/681

Abstract: A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.

Abstract translation: 一种用于在其边缘部分传送设置有切口的圆形基板的基板传送装置，包括：传感器部分，包括三个光源部分，该光源部分将光施加到边缘部分处彼此不同的位置，以及三个光接收部分 光源部件; 以及用于移动所述基板保持部的驱动部，其中，所述三个光源部向所述受光部施加光，使得所述传感器部的检测范围是否与所述基板的切口重叠，基于 每个光接收部分的接收光量，并且当确定在任何位置处存在重叠时，基板的边缘部分的位置被进一步检测到基板相对于传感器部分移位的位置。

公开(公告)号：US12269052B2

公开(公告)日：2025-04-08

申请号：US17179551

申请日：2021-02-19

Applicant: Tokyo Electron Limited

Inventor： Terufumi Wakiyama ,  Yuichi Douki ,  Akinori Tanaka ,  Minoru Tashiro ,  Reo Kitayama ,  Shu Yamamoto

IPC: B05B12/12 ,  B05B3/16 ,  B05B12/10 ,  B05D1/02

Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

公开(公告)号：US11135698B2

公开(公告)日：2021-10-05

申请号：US15181527

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki

IPC: B24B37/005 ,  B24B37/20

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

公开(公告)号：US11024518B2

公开(公告)日：2021-06-01

申请号：US15747921

申请日：2016-07-28

Applicant: Tokyo Electron Limited

Inventor： Norihiro Ito ,  Jiro Higashijima ,  Nobuhiro Ogata ,  Takahisa Otsuka ,  Yuichi Douki ,  Yusuke Hashimoto ,  Kazuhiro Aiura ,  Daisuke Goto

IPC: B08B3/02 ,  H01L21/67 ,  B08B17/02 ,  H01L21/687 ,  B08B3/08 ,  H01L21/02

Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.

公开(公告)号：US09299599B2

公开(公告)日：2016-03-29

申请号：US14248765

申请日：2014-04-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi Douki ,  Tokutarou Hayashi ,  Naruaki Iida ,  Suguru Enokida

IPC: H01L21/00 ,  H05B3/68 ,  C23C16/00 ,  H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/66

CPC classification number: H01L21/68 ,  H01L21/6715 ,  H01L21/67748 ,  H01L21/681 ,  H01L21/68707 ,  H01L22/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.

Abstract translation: 一种能够在不使用任何定位夹具的情况下定位基板支架的基板支架定位方法，包括：测量保持在基板承载机构中的基板保持器上的基板的第一位置; 将保持在所述基板保持器上的所述基板承载到用于保持和旋转所述基板的基板旋转单元; 通过基板旋转单元将由基板旋转单元保持的基板转动预定角度; 将由基板旋转单元转动的基板从基板旋转单元传送到基板保持器; 测量从所述基板旋转单元转移到所述基板保持器的所述基板的第二位置; 基于第一位置和第二位置确定基板旋转单元的旋转中心的位置; 并且基于旋转中心的位置来定位衬底保持器。