SUBSTRATE LIQUID PROCESSING APPARATUS AND LIQUID DISCHARGE EVALUATION METHOD

    公开(公告)号:US20210260612A1

    公开(公告)日:2021-08-26

    申请号:US17179551

    申请日:2021-02-19

    Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

    Substrate liquid processing apparatus and liquid discharge evaluation method

    公开(公告)号:US12269052B2

    公开(公告)日:2025-04-08

    申请号:US17179551

    申请日:2021-02-19

    Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US12276455B2

    公开(公告)日:2025-04-15

    申请号:US17464367

    申请日:2021-09-01

    Abstract: A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pressure container; a depressurizing valve provided in a middle of the discharge line; and a concentration measurement part configured to measure a concentration of vapor of the drying liquid in the fluid flowing through the discharge line, wherein the concentration measurement part is provided on a downstream side of the depressurizing valve of the discharge line and measures the concentration of the drying liquid in the fluid depressurized by the depressurizing valve.

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