公开(公告)号：US20240297061A1

公开(公告)日：2024-09-05

申请号：US18589816

申请日：2024-02-28

Applicant: Tokyo Electron Limited

Inventor： Ryoya TOMINAGA ,  Akashi FUJIO ,  Masami DODO ,  Gaku WATANABE ,  Hiroyuki WADA

IPC: H01L21/68 ,  H01L21/687

CPC classification number: H01L21/681 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771

Abstract: A substrate processing apparatus includes a vacuum container, a rotary table, a stage, a lifter, and a controller that controls an operation of the lifter. The controller automatically sets a control position in the operation of the lifter. The controller, in (A), repeatedly raises the lifter by a first pitch and then determines whether or not the lifter has come into contact with a substrate, thereby bring the lifter to come into contact with the substrate to set a next position. The controller, in (B), repeatedly raises the lifter from the next position by a second pitch shorter than the first pitch and then determines whether or not the lifter has come into contact with the substrate, thereby detecting a touch position and calculating the control position based on the touch position.