公开(公告)号：US11348791B2

公开(公告)日：2022-05-31

申请号：US16884291

申请日：2020-05-27

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Shinichi Shinozuka

IPC: H01L21/18 ,  H01L21/67 ,  B23Q17/24 ,  B23P19/10 ,  B23P21/00 ,  B23Q17/22

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

公开(公告)号：US20220254636A1

公开(公告)日：2022-08-11

申请号：US17661100

申请日：2022-04-28

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Shinichi Shinozuka

IPC: H01L21/18 ,  H01L21/67 ,  B23Q17/24 ,  B23P19/10 ,  B23P21/00 ,  B23Q17/22 ,  H01L21/68

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

公开(公告)号：US20200381255A1

公开(公告)日：2020-12-03

申请号：US16884291

申请日：2020-05-27

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Shinichi Shinozuka

IPC: H01L21/18 ,  H01L21/67

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

公开(公告)号：US20220415673A1

公开(公告)日：2022-12-29

申请号：US17754659

申请日：2020-09-28

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Shigeto Tsuruta ,  Yuji Mimura ,  Hiroshi Maeda ,  Eiji Manabe ,  Hisanori Hizume ,  Shinichi Shinozuka ,  Hironori Tanoue

IPC: H01L21/67 ,  G06T7/00

Abstract: A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.