公开(公告)号：US20230422348A1

公开(公告)日：2023-12-28

申请号：US18210338

申请日：2023-06-15

Applicant: Tokyo Electron Limited

Inventor： Yasuaki KIKUCHI ,  Tatsuya YAMAGUCHI ,  SungDuk SON ,  Miki OUCHI ,  Nobuyuki HIROTA ,  Shingo HISHIYA

IPC: H05B1/02

CPC classification number: H05B1/023

Abstract: A substrate processing apparatus includes a processing container in which a plurality of substrates are processed; a plurality of heaters configured to control a temperature of the plurality of substrates accommodated in the processing container for each of a plurality of zones; and a controller configured to control an operation of the plurality of heaters. The controller is configured to control the plurality of heaters to a set temperature set in advance for each of the plurality of zones, thereby performing a processing on the plurality of substrates accommodated in the processing container, determine whether an abnormality determination condition is satisfied, including that an output value of at least one heater of the plurality of heaters is equal to or less than a heater control resolution, and issue a warning for the set temperature for each of the plurality of zones based on a result of the determining.