公开(公告)号：US20240209507A1

公开(公告)日：2024-06-27

申请号：US18536789

申请日：2023-12-12

Applicant: Tokyo Electron Limited

Inventor： Manabu HONMA ,  Takuya OIKAWA ,  Noriaki FUKIAGE ,  Hiroyuki WADA

IPC: C23C16/458 ,  C23C16/46 ,  H01J37/32

CPC classification number: C23C16/4584 ,  C23C16/46 ,  H01J37/32724 ,  H01J2237/20214 ,  H01J2237/3321

Abstract: A film forming apparatus includes a processing chamber and a substrate support provided in the processing chamber. The substrate support includes a recess in which a substrate is placed. The recess includes a projection at a bottom surface thereof. The projection is provided along an outer periphery of the substrate placed in the recess.