公开(公告)号：US20240263801A1

公开(公告)日：2024-08-08

申请号：US18421407

申请日：2024-01-24

Applicant: Tokyo Electron Limited

Inventor： Tatsuya KAWAJI ,  Shinichiro YAMANAKA ,  Kei MIYAZAKI ,  Shinichi SAGARA

IPC: F24C15/10 ,  F24C7/08 ,  F24C15/12 ,  F24C15/32

CPC classification number: F24C15/101 ,  F24C15/103 ,  F24C15/322 ,  F24C7/083 ,  F24C15/12

Abstract: A thermal treatment apparatus includes: a hot plate on which a substrate is mounted and which is configured to heat the substrate; an upper cover configured to cover a treatment space above the hot plate and form an opening being a carry-in/out port for the substrate to/from the treatment space; an exhauster provided at a position opposite to the opening across the hot plate in plan view and configured to exhaust gas from the treatment space; a shutter configured to cover a lower portion of the opening; and a gas flow guide provided at a position spaced apart from the shutter, wherein the gas flow guide divides gas flowing into the treatment space due to the exhaust of gas by the exhauster from an upper portion of the opening whose lower portion is covered with the shutter, into an upper side and a lower side.