公开(公告)号：US12077392B2

公开(公告)日：2024-09-03

申请号：US17315423

申请日：2021-05-10

申请人： Tokyo Electron Limited

发明人： Hitoshi Hashima ,  Tohru Tochihara ,  Michiaki Matsushita ,  Hidekazu Kiyama

IPC分类号： B65G47/90 ,  G03F7/16 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687 ,  H05K9/00

CPC分类号： B65G47/90 ,  G03F7/162 ,  H01L21/67766 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/6875 ,  H05K9/0067

摘要： A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.