公开(公告)号：US20220037189A1

公开(公告)日：2022-02-03

申请号：US17443286

申请日：2021-07-23

Applicant: Tokyo Electron Limited

Inventor： Yoshinori IKEDA ,  Toru HIRATA

IPC: H01L21/687 ,  H01L21/67

Abstract: A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first damper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second damper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first damper. The controller controls the at least one first damper and the at least one second damper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.

公开(公告)号：US20240178046A1

公开(公告)日：2024-05-30

申请号：US18436248

申请日：2024-02-08

Applicant: Tokyo Electron Limited

Inventor： Yoshinori IKEDA ,  Toru HIRATA

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68721 ,  H01L21/6708 ,  H01L21/68728

Abstract: A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second clamper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first clamper. The controller controls the at least one first clamper and the at least one second clamper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.

公开(公告)号：US20230311170A1

公开(公告)日：2023-10-05

申请号：US18126497

申请日：2023-03-27

Applicant: Tokyo Electron Limited

Inventor： Toru HIRATA ,  Yoshinori IKEDA

IPC: B08B3/04 ,  B08B13/00

CPC classification number: B08B3/04 ,  B08B13/00

Abstract: A substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a processing liquid supply unit that supplies a processing liquid to the substrate, a first processing cup that is provided annularly around the substrate holding unit, a second processing cup that is provided annularly around the substrate holding unit and on an inner side of the first processing cup, a drain port that is formed on a storage unit, a first exhaust port that is provided to exhaust a gas between the first processing cup and the second processing cup, a second exhaust port that is provided on an inner side of the first exhaust port to exhaust a gas on an inner side of the second processing cup, and a suction port that is provided between the drain port and the first exhaust port in a height direction thereof.

公开(公告)号：US20210343576A1

公开(公告)日：2021-11-04

申请号：US17241504

申请日：2021-04-27

Applicant: Tokyo Electron Limited

Inventor： Yoshinori IKEDA ,  Toru HIRATA

IPC: H01L21/687

Abstract: A substrate processing apparatus according to the present disclosure includes a gripping mechanism and a base plate. The gripping mechanism grips a peripheral edge of a substrate. The base plate is located below the substrate gripped by the gripping mechanism and supports the gripping mechanism. Furthermore, the base plate includes a liquid drain hole that discharges a processing liquid flowing from the substrate to an upper surface of the base plate through the gripping mechanism.