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    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    2.
    发明公开
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开

    公开(公告)号：US20230311170A1

    公开(公告)日：2023-10-05

    申请号：US18126497

    申请日：2023-03-27

    Applicant: Tokyo Electron Limited

    Inventor： Toru HIRATA ,  Yoshinori IKEDA

    IPC: B08B3/04 ,  B08B13/00

    CPC classification number: B08B3/04 ,  B08B13/00

    Abstract: A substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a processing liquid supply unit that supplies a processing liquid to the substrate, a first processing cup that is provided annularly around the substrate holding unit, a second processing cup that is provided annularly around the substrate holding unit and on an inner side of the first processing cup, a drain port that is formed on a storage unit, a first exhaust port that is provided to exhaust a gas between the first processing cup and the second processing cup, a second exhaust port that is provided on an inner side of the first exhaust port to exhaust a gas on an inner side of the second processing cup, and a suction port that is provided between the drain port and the first exhaust port in a height direction thereof.

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权

    公开(公告)号：US20210343576A1

    公开(公告)日：2021-11-04

    申请号：US17241504

    申请日：2021-04-27

    Applicant: Tokyo Electron Limited

    Inventor： Yoshinori IKEDA ,  Toru HIRATA

    IPC: H01L21/687

    Abstract: A substrate processing apparatus according to the present disclosure includes a gripping mechanism and a base plate. The gripping mechanism grips a peripheral edge of a substrate. The base plate is located below the substrate gripped by the gripping mechanism and supports the gripping mechanism. Furthermore, the base plate includes a liquid drain hole that discharges a processing liquid flowing from the substrate to an upper surface of the base plate through the gripping mechanism.

    DEVELOPING TREATMENT APPARATUS AND DEVELOPING TREATMENT METHOD
    4.
    发明申请
    DEVELOPING TREATMENT APPARATUS AND DEVELOPING TREATMENT METHOD 有权
    开发治疗设备和开发治疗方法

    公开(公告)号：US20140071411A1

    公开(公告)日：2014-03-13

    申请号：US14022434

    申请日：2013-09-10

    Applicant: Tokyo Electron Limited

    Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

    IPC: G03F7/30

    CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

    Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

    Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
    5.
    发明申请
    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权

    公开(公告)号：US20220037189A1

    公开(公告)日：2022-02-03

    申请号：US17443286

    申请日：2021-07-23

    Applicant: Tokyo Electron Limited

    Inventor： Yoshinori IKEDA ,  Toru HIRATA

    IPC: H01L21/687 ,  H01L21/67

    Abstract: A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first damper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second damper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first damper. The controller controls the at least one first damper and the at least one second damper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.

    DEVELOPING TREATMENT APPARATUS AND DEVELOPING TREATMENT METHOD
    6.
    发明申请
    DEVELOPING TREATMENT APPARATUS AND DEVELOPING TREATMENT METHOD 审中-公开
    开发治疗设备和开发治疗方法

    公开(公告)号：US20160202609A1

    公开(公告)日：2016-07-14

    申请号：US15051780

    申请日：2016-02-24

    Applicant: Tokyo Electron Limited

    Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Yoshinori IKEDA ,  Koki YOSHIMURA ,  Yoshiki OKAMOTO ,  Masahiro FUKUDA

    IPC: G03F7/16

    CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

    Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

    Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
    7.
    发明公开
    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20240178046A1

    公开(公告)日：2024-05-30

    申请号：US18436248

    申请日：2024-02-08

    Applicant: Tokyo Electron Limited

    Inventor： Yoshinori IKEDA ,  Toru HIRATA

    IPC: H01L21/687 ,  H01L21/67

    CPC classification number: H01L21/68721 ,  H01L21/6708 ,  H01L21/68728

    Abstract: A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second clamper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first clamper. The controller controls the at least one first clamper and the at least one second clamper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.

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