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公开(公告)号:US20230395408A1
公开(公告)日:2023-12-07
申请号:US18321432
申请日:2023-05-22
Applicant: Tokyo Electron Limited
Inventor: Ivan MALEEV , Yan SUN , Zheng YAN
CPC classification number: H01L21/67248 , H01L21/67057 , G01N21/6489 , G01N2021/6471
Abstract: Aspects of the present disclosure provide a sensor for remote temperature measurement. For example, the sensor can include a light source configured to form an illumination beam, focusing optics configured to direct the illumination beam from the light source onto a semiconductor sample at an illuminated spot thereof, for exciting bandgap photoluminescence (PL) light in the semiconductor sample, collection optics configured to collect the bandgap PL light excited from the semiconductor sample, at least one optical detector configured to measure spectral intensities of the bandgap PL light in a vicinity of a semiconductor bandgap wavelength of the semiconductor sample, and transmission optics configured to transmit the bandgap PL light from the collection optics to the at least one optical detector.