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公开(公告)号:US20150362546A1
公开(公告)日:2015-12-17
申请号:US14758378
申请日:2013-12-12
发明人: Yasuhiro OSUGA
CPC分类号: G01R31/2601 , G01R1/067 , G01R31/2831 , G01R31/2867 , G03F7/70866 , H01L21/6838 , H01L21/68707
摘要: The present disclosure provides a probe apparatus that is capable of suppressing generation of a transfer error by adsorbing and holding a semiconductor wafer even in a case where the semiconductor wafer has been warped. The probe apparatus includes a measuring section and a loader section, that is, a transfer unit. The loader section is provided with a wafer cassette placed on a load port, a wafer transfer mechanism having a wafer transfer arm, and a gas ejection mechanism having a gas ejection nozzle. When the wafer transfer arm adsorbs and holds a warped semiconductor wafer in the wafer cassette, the gas ejection nozzle ejects a gas from a substantially central portion on the upper side of the semiconductor wafer toward the lower side, thereby reducing warpage of the semiconductor wafer.
摘要翻译: 本公开提供了一种探针装置,其能够即使在半导体晶片翘曲的情况下也能够通过吸附和保持半导体晶片来抑制转印误差的产生。 探针装置包括测量部分和装载部分,即传送单元。 装载器部分设置有放置在装载端口上的晶片盒,具有晶片传送臂的晶片传送机构和具有气体喷射喷嘴的气体喷射机构。 当晶片传送臂在晶片盒中吸收并保持翘曲的半导体晶片时,气体喷射喷嘴从半导体晶片的上侧的大致中央部向下侧喷射气体,从而减小半导体晶片的翘曲。
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公开(公告)号:US20210132135A1
公开(公告)日:2021-05-06
申请号:US16975506
申请日:2019-02-13
发明人: Yasuhiro OSUGA , Koju YAMAMOTO
摘要: An inspection device according to an embodiment can conduct high temperature inspection and low temperature inspection on an object to be inspected. The inspection device includes an inspection chamber in which inspection is conducted on the object; a dry air supply section that is connected to the inspection chamber via a first valve and that is configured to supply dry air into the inspection chamber; a dew point meter that is connected to the inspection chamber via a second valve and that is configured to measure a dew point in the inspection chamber; and a bypass pipe connecting the dry air supply section and the dew point meter via a third valve.
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