公开(公告)号：US20240369339A1

公开(公告)日：2024-11-07

申请号：US18681914

申请日：2022-07-28

Applicant: Tokyo Electron Limited

Inventor： Teruhiko MORIYA ,  Keisuke HAMAMOTO ,  Yohei MAEDA

IPC: G01B5/00 ,  G01B11/06 ,  H01L21/66 ,  H01L21/67

Abstract: A substrate thickness measuring device includes a substrate holder, a thickness measurer, a housing, a temperature measurer and a thickness corrector. The substrate holder is configured to hold a substrate. The thickness measurer is configured to measure a thickness of the substrate held by the substrate holder. The housing accommodates therein the substrate holder and at least a part of the thickness measurer. The thickness corrector is configured to correct the thickness measured by the thickness measurer. The thickness corrector performs: calculating, as a corrected thickness, a product of the thickness measured by the thickness measurer and a preset correction coefficient, and changing a setting of the correction coefficient when the temperature measured by the temperature measurer falls out of a preset allowable range.