EXPOSURE APPARATUS, EXPOSURE APPARATUS ADJUSTMENT METHOD AND STORAGE MEDIUM

    公开(公告)号:US20180136567A1

    公开(公告)日:2018-05-17

    申请号:US15813464

    申请日:2017-11-15

    Abstract: An exposure apparatus includes a stage on which a substrate is placed, a plurality of light irradiation units configured to emit light independently of each other to different positions in a right and left direction on a surface of the substrate, so as to form a strip-like irradiation area extending from one end of the surface of the substrate to the other end of the substrate, a stage moving mechanism configured to move the stage in a back and forth direction relative to the irradiation area, such that the whole surface of the substrate is exposed, and a light receiving unit configured move in the irradiation area between one end and the other end of the irradiation area in order to detect an illuminance distribution of the irradiation area in a longitudinal direction of the irradiation area.

    SUBSTRATE THICKNESS MEASURING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE THICKNESS MEASURING METHOD

    公开(公告)号:US20240369339A1

    公开(公告)日:2024-11-07

    申请号:US18681914

    申请日:2022-07-28

    Abstract: A substrate thickness measuring device includes a substrate holder, a thickness measurer, a housing, a temperature measurer and a thickness corrector. The substrate holder is configured to hold a substrate. The thickness measurer is configured to measure a thickness of the substrate held by the substrate holder. The housing accommodates therein the substrate holder and at least a part of the thickness measurer. The thickness corrector is configured to correct the thickness measured by the thickness measurer. The thickness corrector performs: calculating, as a corrected thickness, a product of the thickness measured by the thickness measurer and a preset correction coefficient, and changing a setting of the correction coefficient when the temperature measured by the temperature measurer falls out of a preset allowable range.

    OPTICAL PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20180164696A1

    公开(公告)日:2018-06-14

    申请号:US15828906

    申请日:2017-12-01

    Abstract: An optical processing apparatus includes: a housing; a stage; and a light irradiation unit configured to cause a light source unit to emit light so as to form a strip-like irradiation area extending over an area wider than a width of a substrate in a right and left direction. The stage and the light irradiation unit are moved by a moving mechanism relatively to each other in a back and forth direction. Light emitted from the light irradiation unit is deviated by a light-path changing unit from a relative movement area of a substrate. When a substrate is relatively moved below the light irradiation unit without the intension of being subjected to a light irradiation process, a control unit outputs a control signal such that an irradiation area is not formed on a surface of the substrate by the light-path changing unit, while the light source unit emitting light.

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