公开(公告)号：US20160190024A1

公开(公告)日：2016-06-30

申请号：US14970714

申请日：2015-12-16

Applicant: Tokyo Electron Limited

Inventor： Masahiro NUMAKURA ,  Yoshikazu ISHIKAWA ,  Toshihiko HAMADA ,  Junya SATO ,  Toshiyuki KOBAYASHI ,  Shouichi OTAKE

IPC: H01L21/66 ,  H01J37/32

CPC classification number: H01J37/32009 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67742

Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

Abstract translation: 衬底处理设备包括被配置为处理第一衬底的至少一个处理模块。 位置检测器被配置为检测第一基板的第一位置。 控制单元被配置为控制位置检测器，以便根据为相同处理模块设置的测量间隔，在相同的处理模块中测量从待处理的第一基板中选择的第二基板的第二位置。