公开(公告)号：US20190181031A1

公开(公告)日：2019-06-13

申请号：US16210364

申请日：2018-12-05

Applicant: Tokyo Electron Limited

Inventor： Toshiyuki KOBAYASHI ,  Ryu KITAHARA ,  Kazuya KOSHIISHI ,  Junya SATO ,  Shun SUTO ,  Toshimitsu CHIBA

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/68 ,  H01L21/67

Abstract: A teaching method according to an embodiment is for a transfer device including a substrate holding unit including a suction port for holding a substrate by applying suction, an actuation mechanism for moving the substrate holding unit, and a pressure detecting unit for detecting a pressure in a suction path communicating with the suction port. The method includes: moving the substrate holding unit under the substrate; moving the substrate holding unit upward toward the substrate, while applying suction to the suction path and detecting the pressure in the suction path; determining whether or not the substrate holding unit has touched the substrate, based on the pressure in the suction path; and storing, as a standard position, a position of the substrate holding unit at a time of determining that the substrate holding unit has touched the substrate.

公开(公告)号：US20130204425A1

公开(公告)日：2013-08-08

申请号：US13804452

申请日：2013-03-14

Applicant: Tokyo Electron Limited

Inventor： Yo ABE ,  Kiichi TAKAHASHI ,  Junya SATO ,  Yoshinobu MOTODATE

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67781

Abstract: When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.

Abstract translation: 当基板被保持臂转移到多层晶片舟皿时，防止了保持臂和基板之间的接触。 当晶片舟不受热效应时，通过相对于晶片舟相对地升高和降低转印基底构件，获得环形构件的正常高度位置。 在尚未热处理的晶片被转移到晶片舟皿之前，获得相应的环件的高度位置。 通过比较环状构件的正常高度位置与晶片运送前环状构件的高度位置之间的差异，可以判断是否通过晶片传送机构将晶片转移到晶片舟皿上。

公开(公告)号：US20160190024A1

公开(公告)日：2016-06-30

申请号：US14970714

申请日：2015-12-16

Applicant: Tokyo Electron Limited

Inventor： Masahiro NUMAKURA ,  Yoshikazu ISHIKAWA ,  Toshihiko HAMADA ,  Junya SATO ,  Toshiyuki KOBAYASHI ,  Shouichi OTAKE

IPC: H01L21/66 ,  H01J37/32

CPC classification number: H01J37/32009 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67742

Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

Abstract translation: 衬底处理设备包括被配置为处理第一衬底的至少一个处理模块。 位置检测器被配置为检测第一基板的第一位置。 控制单元被配置为控制位置检测器，以便根据为相同处理模块设置的测量间隔，在相同的处理模块中测量从待处理的第一基板中选择的第二基板的第二位置。