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公开(公告)号:US20240361687A1
公开(公告)日:2024-10-31
申请号:US18769841
申请日:2024-07-11
Applicant: Tokyo Electron Limited
Inventor: Takuya MIURA , Kouichirou TANAKA , Shogo TAKAHASHI , Yusuke MIYAKUBO , Kentaro YOSHIHARA
IPC: G03F7/00
CPC classification number: G03F7/0025
Abstract: A nozzle unit for a liquid treatment apparatus that performs a liquid treatment on a substrate using a liquid, includes a first gas nozzle having a discharge flow path for allowing a first gas to flow through the discharge flow path and a first discharge port for discharging the first gas flowing through the discharge flow path toward a surface of the substrate, wherein the first discharge port is formed so as to extend in a first direction along the surface, and wherein a width of the discharge flow path in the first direction increases as the discharge flow path approaches the first discharge port, so that the first gas is discharged radially from the first discharge port.
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公开(公告)号:US20250166167A1
公开(公告)日:2025-05-22
申请号:US18953435
申请日:2024-11-20
Applicant: Tokyo Electron Limited
Inventor: Yusuke MIYAKUBO
IPC: G06T7/00 , G03F7/38 , H01L21/67 , H01L21/677 , H04N23/698
Abstract: A substrate processing system includes: a substrate processing apparatus including a storage space where a substrate is accommodated; a camera directed toward the storage space; a pattern provided to extend within a field of view of the camera and configured to be captured by the camera through the storage space; and a map generation unit that generates map data indicating a fluid flow distribution in the storage space based on a change of an image of the pattern captured by the camera.
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公开(公告)号:US20210333707A1
公开(公告)日:2021-10-28
申请号:US17238541
申请日:2021-04-23
Applicant: Tokyo Electron Limited
Inventor: Takuya MIURA , Kouichirou TANAKA , Shogo TAKAHASHI , Yusuke MIYAKUBO , Kentaro YOSHIHARA
IPC: G03F7/00
Abstract: A nozzle unit for a liquid treatment apparatus that performs a liquid treatment on a substrate using a liquid, includes a first gas nozzle having a discharge flow path for allowing a first gas to flow through the discharge flow path and a first discharge port for discharging the first gas flowing through the discharge flow path toward a surface of the substrate, wherein the first discharge port is formed so as to extend in a first direction along the surface, and wherein a width of the discharge flow path in the first direction increases as the discharge flow path approaches the first discharge port, so that the first gas is discharged radially from the first discharge port.
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