公开(公告)号：US09962915B2

公开(公告)日：2018-05-08

申请号：US14376791

申请日：2013-01-23

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Atsushi Miyanari ,  Yoshihiro Inao ,  Shigeru Kato ,  Takahiro Setaka ,  Shingo Ishida

IPC分类号： H01L21/68 ,  B32B37/10 ,  B32B37/06 ,  H01L21/67 ,  B32B37/04 ,  H05K3/00

CPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/10 ,  B32B2398/20 ,  H01L21/67092 ,  H01L21/67132 ,  H01L2924/0002 ,  H05K3/0058

摘要： A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

公开(公告)号：US20140374017A1

公开(公告)日：2014-12-25

申请号：US14376791

申请日：2013-01-23

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Atsushi Miyanari ,  Yoshihiro Inao ,  Shigeru Kato ,  Takahiro Setaka ,  Shingo Ishida

IPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/10

CPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/10 ,  B32B2398/20 ,  H01L21/67092 ,  H01L21/67132 ,  H01L2924/0002 ,  H05K3/0058

摘要： A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

摘要翻译： 形成包括将热塑性粘合剂施加到基板或支撑板和粘合剂层的粘合层形成工艺的粘合方法; 其中形成在基板或支撑板上的粘合剂层被加热的加热过程; 以及通过加热的粘合剂层将基板和支撑板彼此挤压的粘合工艺，从而粘合基板和支撑板。

公开(公告)号：US08882096B2

公开(公告)日：2014-11-11

申请号：US13939524

申请日：2013-07-11

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC分类号： B23Q7/00 ,  H01L21/02 ,  H01L21/687 ,  H01L21/67

CPC分类号： H01L21/02002 ,  H01L21/67132 ,  H01L21/68757 ,  Y10T29/49998 ,  Y10T156/1062 ,  Y10T156/1798

摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

摘要翻译： 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。

公开(公告)号：US20140151328A1

公开(公告)日：2014-06-05

申请号：US14072158

申请日：2013-11-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Atsushi Miyanari ,  Akihiko Nakamura

IPC分类号： H01L21/683

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate 10 includes a protective layer forming step of forming a protective layer 15 for covering a face that is a surface of a release layer 14 and which is not adhered to a support plate 12 and not superimposed at least on an adhesive layer 13; and a protective layer removal step of removing a portion of the protective layer 15, which is exposed at the time of forming the laminate 10.

摘要翻译： 当层压体进行所需的处理时，释放层被保护层充分地保护。 形成层压体10的方法包括形成保护层15的保护层形成步骤，该保护层形成工序形成保护层15，该保护层15覆盖作为剥离层14的表面的面，并且不附着在支撑板12上， 层13; 以及去除在形成层压体10时露出的保护层15的一部分的保护层去除步骤。