公开(公告)号：US09627235B2

公开(公告)日：2017-04-18

申请号：US14698049

申请日：2015-04-28

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yasumasa Iwata ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Shinji Takase ,  Takahiro Yoshioka

IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B32B37/02 ,  B32B38/10 ,  B32B38/18 ,  B32B37/26

CPC分类号： H01L21/67092 ,  B32B37/02 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/202 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2313/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1189 ,  Y10T156/1917

摘要： A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

公开(公告)号：US08882096B2

公开(公告)日：2014-11-11

申请号：US13939524

申请日：2013-07-11

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC分类号： B23Q7/00 ,  H01L21/02 ,  H01L21/687 ,  H01L21/67

CPC分类号： H01L21/02002 ,  H01L21/67132 ,  H01L21/68757 ,  Y10T29/49998 ,  Y10T156/1062 ,  Y10T156/1798

摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

摘要翻译： 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。

公开(公告)号：US09337074B2

公开(公告)日：2016-05-10

申请号：US14431902

申请日：2013-09-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yoshihiro Inao ,  Shigeru Kato ,  Shugo Tsushima ,  Junichi Katsuragawa ,  Satoshi Kobari ,  Akihiko Nakamura

IPC分类号： H01L21/68 ,  H01L21/683 ,  H01L21/67 ,  B25J15/00 ,  H01L21/687 ,  B25J11/00

CPC分类号： H01L21/6835 ,  B25J11/0095 ,  B25J15/0042 ,  H01L21/67092 ,  H01L21/687 ,  H01L21/68721 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/17

摘要： An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.

摘要翻译： 配置成通过粘合剂层附接基板和支撑件的附接装置设置有支撑保持构件。 支撑保持构件的保持工具被构造成将支撑件保持在保持工具的倾斜表面部分（接触构件）上，而不与待附接到基板的支撑体的表面接触。 附着装置将表面保持不与其接触的支撑体附接到基板。

公开(公告)号：US20150262858A1

公开(公告)日：2015-09-17

申请号：US14431902

申请日：2013-09-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yoshihiro Inao ,  Shigeru Kato ,  Shugo Tsushima ,  Junichi Katsuragawa ,  Satoshi Kobari ,  Akihiko Nakamura

IPC分类号： H01L21/683

CPC分类号： H01L21/6835 ,  B25J11/0095 ,  B25J15/0042 ,  H01L21/67092 ,  H01L21/687 ,  H01L21/68721 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T156/17

摘要： An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.

摘要翻译： 配置成通过粘合剂层附接基板和支撑件的附接装置设置有支撑保持构件。 支撑保持构件的保持工具被构造成将支撑件保持在保持工具的倾斜表面部分（接触构件）上，而不与待附接到基板的支撑体的表面接触。 附着装置将表面保持不与其接触的支撑体附接到基板。

公开(公告)号：US09837298B2

公开(公告)日：2017-12-05

申请号：US14940506

申请日：2015-11-13

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Akihiko Nakamura ,  Kimihiro Nakada

IPC分类号： H01L21/683 ,  B32B38/00 ,  H01L21/48 ,  H01L23/31 ,  B32B37/18 ,  B32B7/12 ,  B32B38/10 ,  H01L21/56 ,  B32B37/26 ,  B32B37/12 ,  B32B7/06 ,  B32B9/04 ,  B32B27/28 ,  B32B27/30 ,  B32B3/02 ,  B32B3/08 ,  B32B3/10 ,  B32B3/30

CPC分类号： H01L21/6835 ,  B32B3/02 ,  B32B3/085 ,  B32B3/10 ,  B32B3/30 ,  B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/283 ,  B32B27/308 ,  B32B37/182 ,  B32B38/0012 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2037/268 ,  B32B2038/0016 ,  B32B2250/44 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2310/0831 ,  B32B2457/08 ,  B32B2457/14 ,  H01L21/4803 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.

公开(公告)号：US09272494B2

公开(公告)日：2016-03-01

申请号：US14270024

申请日：2014-05-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Akihiko Nakamura ,  Yoshihiro Inao ,  Shigeru Kato

IPC分类号： B30B15/06 ,  B32B37/10 ,  B30B15/04 ,  B32B37/00 ,  B32B37/06 ,  B32B37/12 ,  B32B38/18

CPC分类号： B32B37/10 ,  B30B15/045 ,  B30B15/064 ,  B32B37/0015 ,  B32B37/0046 ,  B32B37/06 ,  B32B37/1284 ,  B32B38/1833 ,  B32B2309/02 ,  B32B2309/10 ,  B32B2309/12 ,  B32B2457/14

摘要： A sticking apparatus including a pair of plate members sandwiching a laminate between the pair of plate members, and supporting members supporting the plate members. The supporting members supporting at least one of the plate members are located in a form of multiple dots or lines adjacent to each other at regular intervals on the plate member.

摘要翻译： 一种粘贴装置，包括一对夹在所述一对板状部件之间的层叠体的板状部件，以及支撑板状部件的支承部件。 支撑至少一个板构件的支撑构件以规则间隔彼此相邻的多个点或线的形式定位在板构件上。

公开(公告)号：US20150325465A1

公开(公告)日：2015-11-12

申请号：US14698049

申请日：2015-04-28

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yasumasa Iwata ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Shinji Takase ,  Takahiro Yoshioka

IPC分类号： H01L21/683 ,  B32B43/00

CPC分类号： H01L21/67092 ,  B32B37/02 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/202 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2313/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1189 ,  Y10T156/1917

摘要： A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

摘要翻译： 一种支撑构件分离方法，用于分离通过粘合剂层层叠基板和支撑板而形成的层压体，并且其中在基板侧的表面的周边部分的至少一部分上设置有剥离层 面对支撑板或面向基板的支撑板侧表面上的周边部分，该方法包括降低设置在基板的周边部分上的剥离层的至少一部分的粘合力或 支撑并固定在基板和支撑板上的部件，并且在预处理之后，通过向另一部分施加力将基板与基板分离。

公开(公告)号：US20140332149A1

公开(公告)日：2014-11-13

申请号：US14270086

申请日：2014-05-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yasushi Fujii ,  Akihiko Nakamura ,  Yasumasa Iwata ,  Shingo Ishida

IPC分类号： B29C65/72

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

摘要翻译： 一种加工模具材料的方法，该方法包括加热由模具材料形成的模具材料层以从构成模具材料层的模具材料排出气体的加热步骤。

公开(公告)号：US20140332147A1

公开(公告)日：2014-11-13

申请号：US14270024

申请日：2014-05-05

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Akihiko Nakamura ,  Yoshihiro Inao ,  Shigeru Kato

IPC分类号： B32B37/10

CPC分类号： B32B37/10 ,  B30B15/045 ,  B30B15/064 ,  B32B37/0015 ,  B32B37/0046 ,  B32B37/06 ,  B32B37/1284 ,  B32B38/1833 ,  B32B2309/02 ,  B32B2309/10 ,  B32B2309/12 ,  B32B2457/14

摘要： A sticking apparatus including a pair of plate members sandwiching a laminate between the pair of plate members, and supporting members supporting the plate members. The supporting members supporting at least one of the plate members are located in a form of multiple dots or lines adjacent to each other at regular intervals on the plate member.

摘要翻译： 一种粘贴装置，包括一对夹在所述一对板状部件之间的层叠体的板状部件，以及支撑板状部件的支承部件。 支撑至少一个板构件的支撑构件以规则间隔彼此相邻的多个点或线的形式定位在板构件上。

公开(公告)号：US20140169929A1

公开(公告)日：2014-06-19

申请号：US14071060

申请日：2013-11-04

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Yoshihiro Inao ,  Satoshi Kobari ,  Akihiko Nakamura

IPC分类号： B25J15/06

CPC分类号： H01L21/6838

摘要： A transport arm including a holding unit that holds a substrate by vacuum adsorption. The holding unit has an air discharge port and an adsorption member formed so as to surround the air discharge port. The adsorption member is a squeeze packing.

摘要翻译： 一种输送臂，包括通过真空吸附保持基板的保持单元。 保持单元具有形成为围绕排气口的排气口和吸附构件。 吸附构件是挤压填料。