公开(公告)号：US12282061B2

公开(公告)日：2025-04-22

申请号：US18774727

申请日：2024-07-16

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Akira Yamaguchi ,  Yuta Sato ,  Naoki Kasai ,  Naoyuki Yamazoe ,  Tetsuya Yasunaka ,  Kazuma Takii ,  Teppei Aoki ,  Wataru Kawasaki ,  Hiroki Ishida ,  Yasuhito Iguchi

IPC: G01R31/28 ,  G01R1/04 ,  G01R1/073

Abstract: The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; an overhead hoist transport that delivers the cassette that houses the plurality of semiconductor wafers to be inspected to the prober and withdraws, from the prober, the cassette that houses the semiconductor wafers that have been inspected; a conveying control unit that controls the overhead hoist transport to convey the probe card between a replacement position of the probe card predetermined in the prober and a storage of the probe card located in a place different from the prober; and a card conveying mechanism that conveys the probe card between a holding position in the prober and the replacement position.