公开(公告)号：US11504869B2

公开(公告)日：2022-11-22

申请号：US17187538

申请日：2021-02-26

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Takahiro Iida ,  Teruhiko Nishikawa ,  Tasuku Shimizu

IPC: B24B51/00 ,  B26D3/06 ,  B26D5/00 ,  B26D7/01 ,  B24B19/02 ,  B23Q15/26 ,  B23Q17/24 ,  B23C3/28

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

公开(公告)号：US11571785B2

公开(公告)日：2023-02-07

申请号：US17334337

申请日：2021-05-28

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Takahiro Iida ,  Teruhiko Nishikawa ,  Tasuku Shimizu

IPC: B24B47/22 ,  B24B41/06 ,  B24B51/00 ,  B24B49/12 ,  B26D3/06 ,  B23C3/04 ,  B26D5/00 ,  B24B19/02

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

公开(公告)号：US11472055B2

公开(公告)日：2022-10-18

申请号：US17187501

申请日：2021-02-26

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Takahiro Iida ,  Teruhiko Nishikawa ,  Tasuku Shimizu

IPC: B26D3/06 ,  B26D5/00 ,  B26D7/01 ,  B23C3/28 ,  B23Q15/26 ,  B23Q17/24 ,  B24B19/02 ,  B24B51/00

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

公开(公告)号：US11964361B2

公开(公告)日：2024-04-23

申请号：US17270388

申请日：2020-03-03

Applicant: Tokyo Seimitsu Co., Ltd.

Inventor： Takahiro Iida ,  Teruhiko Nishikawa ,  Tasuku Shimizu

IPC: B24B47/22 ,  B23C3/04 ,  B24B41/06 ,  B24B49/12 ,  B24B51/00 ,  B26D3/06 ,  B26D5/00 ,  B24B19/02

CPC classification number: B24B47/22 ,  B23C3/04 ,  B24B41/06 ,  B24B49/12 ,  B24B51/00 ,  B26D3/065 ,  B26D5/00 ,  B24B19/02

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.