公开(公告)号：US20170236048A1

公开(公告)日：2017-08-17

申请号：US15519029

申请日：2015-10-28

Applicant: Toppan Forms Co., Ltd.

Inventor： Norihiro Ooishi ,  Hitoshi Kagaya ,  Yoshihiro Mizunuma

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: G06K19/07745 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07786 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/0464

Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.

公开(公告)号：US20150339567A1

公开(公告)日：2015-11-26

申请号：US14647746

申请日：2013-11-28

Applicant: TOPPAN FORMS CO., LTD.

Inventor： Nobuyuki Hirasaki ,  Yuya Takahashi ,  Hitoshi Kagaya

IPC: G06K19/077 ,  H01Q1/22 ,  G06K7/10 ,  H01Q21/00

CPC classification number: G06K19/07794 ,  G06K7/10009 ,  G06K19/0723 ,  G06K19/07758 ,  H01Q1/2225 ,  H01Q9/26 ,  H01Q21/0087 ,  Y10T29/4902

Abstract: A radio IC-mounted article communicates in a microwave band or an ultrahigh frequency band, and is provided with: a substrate on which an IC chip and an antenna electrically connected to the IC chip are mounted; a first booster antenna electromagnetically coupled to the antenna; a second booster antenna electromagnetically coupled to the first booster antenna; and an article on which the substrate, the first booster antenna, and the second booster antenna are mounted.

Abstract translation: 无线IC安装物品在微波频带或超高频段中通信，并且设置有：其上安装IC芯片和与IC芯片电连接的天线的基板; 电磁耦合到天线的第一增强天线; 电磁耦合到第一增强天线的第二增强天线; 以及其上安装有基板，第一增强天线和第二增强天线的物品。

公开(公告)号：US10303994B2

公开(公告)日：2019-05-28

申请号：US15519029

申请日：2015-10-28

Applicant: Toppan Forms Co., Ltd.

Inventor： Norihiro Ooishi ,  Hitoshi Kagaya ,  Yoshihiro Mizunuma

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q7/00 ,  H01Q1/38

Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.