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    Techniques for providing an EMI seal for a circuit board
    2.
    发明授权
    Techniques for providing an EMI seal for a circuit board 有权
    为电路板提供EMI封装的技术

    公开(公告)号：US07433203B1

    公开(公告)日：2008-10-07

    申请号：US11290015

    申请日：2005-11-30

    申请人： George Youzhi Yi ,  William Jeffrey Lewis ,  Hung-Ting Lin ,  Kuang Hsin Hsu

    发明人： George Youzhi Yi ,  William Jeffrey Lewis ,  Hung-Ting Lin ,  Kuang Hsin Hsu

    IPC分类号： H05K7/18

    CPC分类号： H05K1/0218 ,  H05K9/002 ,  H05K9/0039 ,  H05K2201/09618 ,  H05K2201/09972 ,  H05K2201/10106

    摘要： A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).

    摘要翻译： 电路板包括被配置为支持一组发光二极管的第一电路板部分，被配置为支持高速电子电路的第二电路板部分和限定第一电路之间的EMI边界的边界部分 板部分和第二电路板部分。 边界部分包括一组外表面细长的接地条，其被配置为形成EMI密封件，一组EMI屏蔽件能够安装到该EMI密封件上。 在一些布置中，该组外表面细长接地条带呈金属带（例如铜层）的形式。 这样的带可以集成到电路板本身中（例如，在PCB制造期间），或者被添加到一个或多个电路板表面上（例如，在PCB制造之后）。