利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.023 秒)

    Filter array having a plurality of capacitance elements
    1.
    发明授权
    Filter array having a plurality of capacitance elements 失效
    具有多个电容元件的滤波器阵列

    公开(公告)号：US5023578A

    公开(公告)日：1991-06-11

    申请号：US481738

    申请日：1990-02-14

    申请人： Toshimi Kaneko ,  Hidetoshi Yamamoto ,  Takayuki Hirotsuji

    发明人： Toshimi Kaneko ,  Hidetoshi Yamamoto ,  Takayuki Hirotsuji

    IPC分类号： H03H1/00

    CPC分类号： H03H1/0007

    摘要： A filter array includes a dielectric unit with a plurality of individual electrodes formed on one main surface and a common electrode on the other main surface. The individual electrodes are formed at predetermined intervals so as to extend across the dielectric unit in a direction of a width of the dielectric unit. Since each of the individual electrodes and the common electrode face each other, they form with the dielectric unit, a plurality of capacitance elements. To both ends of each of the individual electrodes, input and output terminals are respectively connected. The input and output terminals project outward from the dielectric unit. A conductive plate is joined to the common electrode, and common terminals are integrally formed on the conductive plate so as to extend outward in a direction of the width of the dielectric unit. Each of the pairs of input and output terminals are inserted and connected to respective signal lines and the common terminals are connected to ground.

    摘要翻译： 滤波器阵列包括具有形成在一个主表面上的多个单独电极和另一个主表面上的公共电极的介电单元。 单个电极以预定的间隔形成，以便在电介质单元的宽度方向上延伸穿过电介质单元。 由于每个单独电极和公共电极彼此面对，它们与电介质单元形成多个电容元件。 在各个电极的两端分别连接有输入输出端子。 输入和输出端子从电介质单元向外突出。 导电板接合到公共电极，并且公共端子一体地形成在导电板上，以便在电介质单元的宽度方向向外延伸。 每对输入和输出端子被插入并连接到相应的信号线，并且公共端子连接到地。

    Electronic device having electric wires and method of producing same
    2.
    发明授权
    Electronic device having electric wires and method of producing same 有权
    具有电线的电子装置及其制造方法

    公开(公告)号：US06552642B1

    公开(公告)日：2003-04-22

    申请号：US09317665

    申请日：1999-05-24

    申请人： Takaomi Toi ,  Tetsuya Morinaga ,  Masahiro Bando ,  Tetsuo Hatakenaka ,  Kazuo Kasahara ,  Koki Sasaki ,  Takayuki Hirotsuji

    发明人： Takaomi Toi ,  Tetsuya Morinaga ,  Masahiro Bando ,  Tetsuo Hatakenaka ,  Kazuo Kasahara ,  Koki Sasaki ,  Takayuki Hirotsuji

    IPC分类号： H01F2729

    CPC分类号： B23K20/023 ,  B23K2101/40 ,  H01F17/045 ,  H01F27/292 ,  H01F41/10 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

    摘要翻译： 包括以高度可靠的方式牢固地连接到电极的电线的芯片线圈等电子装置被构造成以稳定可靠的方式安装在印刷电路板或基板上。 在芯片线圈的芯的两端，设置有包括由Ag，Ag-Pd或类似材料制成的高导电层的多层结构的电极; 由Ni制成的阻焊层; 以及由Sn或焊料制成的易焊层。 电线的端部埋设在易焊接层中，使得所得的电极结构具有基本平坦的表面。 进行热压处理，使得电线的端部通过固体焊接与阻焊层连接，并通过钎焊与易焊接层连接。