摘要:
An air-purifying device for a front-opening unified pod to purify the air in it is provided. The air in the front-opening unified pod 51 is sucked through one of its breathing holes 58a and directed into an air-purifying device (M) that includes a fan-driving means 1, a dust-filtering means 2, and a chemical-filtering means 3. The moisture, chemical gases, and dust in the air are removed by the air-purifying device (M), and then the purified air is forced into the front-opening unified pod 51 through the other breathing hole 58b. Thus the air in the front-opening unified pod 51 is purified, and its purity is maintained by circulating the air.
摘要:
An air-purifying device for a front-opening unified pod to purify the air in it is provided. The air in the front-opening unified pod 51 is sucked through one of its breathing holes 58a and directed into an air-purifying device (M) that comprises a fan-driving means 1, a dust-filtering means 2, and a chemical-filtering means 3. The moisture, chemical gases, and dust in the air are removed by the air-purifying device (M), and then the purified air is forced into the front-opening unified pod 51 through the other breathing hole 58b. Thus the air in the front-opening unified pod 51 is purified, and its purity is maintained by circulating the air.
摘要:
An apparatus for charging dry air or nitrogen gas into a container for storing semiconductor wafers can remove chemical gas and moisture from the container, and then prevent acid from being generated at the surfaces of the wafers.The apparatus A for charging dry air or nitrogen gas into a container 1 for storing semiconductor wafers 9 is connected to an opening 8a, acting as an intake, and to an opening 8b, acting as an exhaust, wherein the container 1 comprises a plurality of openings 8 disposed at the bottom plate of the container 1, the apparatus comprising:PTFE filters 7 disposed at the plurality of openings 8a, 8b, a portion 11 for providing the dry air or nitrogen gas to the container 1, anda portion 12 for exhausting the used dry air or nitrogen gas from the container 1 after removing chemical gas and moisture from the container, and then preventing acid from being generated at the surfaces of the wafers 9.
摘要:
A remover that removes the static charges on surfaces of substrates of semiconductors and liquid crystals in the processes for manufacturing them is provided. A cylindrical filter in the remover cannot be affected by soft X-rays, and the X-rays cannot leak outside the guiding vessel.A portion 1 for generating purified air that comprises a cylindrical filter 5, a portion 2 for irradiation of soft X-rays 19, and a portion 3 for blowing out the ionized purified air, are arranged in the direction of the air flow in a guiding vessel 4. Also, a shield 23 prevents the portion 1 for generating purified air from being exposed to the irradiation. Further, the portion 3 has a construction wherein the ionized purified air 35 is blown at an equal rate of flow along the longitudinal direction of the remover and prevents the soft X-rays 19 from leaking outside the guiding vessel 4.
摘要:
In a semiconductor-fabrication equipment of a minienvironment system, ambient air is prevented from entering a gap between an opening of the semiconductor-fabrication equipment and a wafer gateway of a hermetic container to prevent dust entrained in the ambient air from adhering to wafers in the hermetic container. Clean air is injected from a clean-air injection device (1), which is connected to an air-supply device (2) through an air-supply tube (3), and which is provided with filter means (6a) in the from of rectangular frame formed with cylindrically-shaped filters connected to each other, to form an air curtain at the gap (96) between the gateway (74) of the hermetic container (71) through which wafers (73) are taken out of or put in the hermetic container (71) and the opening (98) of a loading part (78) attached to a front panel (77) of the semiconductor-fabrication equipment (76), thereby shutting off the ambient air that would otherwise enter the hermetic container (71) through the gap (96) between the gateway (74) of the hermetic container (71) and the opening (98) of the loading part (78) attached to the semiconductor-fabrication equipment (76) when a lid (75) of the hermetic container (71) is opened into the semiconductor-fabrication equipment (76).
摘要:
In a semiconductor-fabrication equipment of a minienvironment system, ambient air is prevented from entering a gap between an opening of the semiconductor-fabrication equipment and a wafer gateway of a hermetic container to prevent dust entrained in the ambient air from adhering to wafers in the hermetic container. Clean air is injected from a clean-air injection device (1), which is connected to an air-supply device (2) through an air-supply tube (3), and which is provided with filter means (6a) in the from of rectangular frame formed with cylindrically-shaped filters connected to each other, to form an air curtain at the gap (96) between the gateway (74) of the hermetic container (71) through which wafers (73) are taken out of or put in the hermetic container (71) and the opening (98) of a loading part (78) attached to a front panel (77) of the semiconductor-fabrication equipment (76), thereby shutting off the ambient air that would otherwise enter the hermetic container (71) through the gap (96) between the gateway (74) of the hermetic container (71) and the opening (98) of the loading part (78) attached to the semiconductor-fabrication equipment (76) when a lid (75) of the hermetic container (71) is opened into the semiconductor-fabrication equipment (76).
摘要:
A sheet 1 for shielding soft X-rays comprises a first outer sheet, an interlayer sheet, and a second outer sheet. In the first outer sheet a port for supplying ionized air is formed. In the interlayer sheet a passage for the ionized air, which passage communicates with the port for supplying the ionized air, is formed. In the second outer sheet a port for discharging the ionized air, which port communicates with the passage for the ionized air, is formed. The sheets 2, 3, and 4 are stacked and adhered so that the sheet 1 has one or more portions 9 for transmitting the ionized air, which portions connect the port for supplying the ionized air, the passage for the ionized air, and the port for discharging the ionized air.
摘要:
An air-purifying device whose space for installation has an elongated shape, air to which is supplied through a duct or a tube, and which can uniformly cause the air to exit the surrounding space. It comprises a hollow cylindrical filter (3) made by forming a filter media (1) in a cylindrical shape having an air passage (2) in the central hollow portion, and a pair of air intake members (6) made of a hollow cylindrical body that has a closed bottom (4) having an air intake hole (5) tightly fixed with sealing material on both ends of the hollow cylindrical filter so that the hole communicates with the air passage.
摘要:
A sheet 1 for shielding soft X-rays comprises a first outer sheet, an interlayer sheet, and a second outer sheet. In the first outer sheet a port for supplying ionized air is formed. In the interlayer sheet a passage for the ionized air, which passage communicates with the port for supplying the ionized air, is formed. In the second outer sheet a port for discharging the ionized air, which port communicates with the passage for the ionized air, is formed. The sheets 2, 3, and 4 are stacked and adhered so that the sheet 1 has one or more portions 9 for transmitting the ionized air, which portions connect the port for supplying the ionized air, the passage for the ionized air, and the port for discharging the ionized air.
摘要:
A semiconductor manufacturing device (76) of a minienvironment system, in which system a wafer (73) is conveyed by a wafer hermetic container (71) to the semiconductor manufacturing device equipped with a wafer carrying-in opening (98), comprising a clean-air injection semiconductor manufacturing device (1) for forming a clean-air curtain between an opened opening (74) of the hermetic container and the wafer carrying-in opening to prevent ambient air from entering the opened opening (74) of the hermetic container when the hermetic container (71), which is located in front of the wafer carrying-in opening of the semiconductor manufacturing, is opened.