公开(公告)号：US20080014542A1

公开(公告)日：2008-01-17

申请号：US11689156

申请日：2007-03-21

申请人： Toshiyuki ASAI ,  Motohiro Yamane ,  Takayuki Matsuoka ,  Atsushi Tanaka

发明人： Toshiyuki ASAI ,  Motohiro Yamane ,  Takayuki Matsuoka ,  Atsushi Tanaka

IPC分类号： F27B9/14

CPC分类号： B23K1/008 ,  B23K2101/42

摘要： A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

摘要翻译： 回流炉包括：载体装置，用于承载安装有电子部件的印刷电路板; 加热室，其通过环境气体加热承载在其中的印刷电路板，以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备，其包括回收装置，用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分，用于将回收的环境气体加热至所需温度的加热装置，用于燃烧所含有的助熔剂组分的氧化催化剂 加热环境气体和返回装置，以在燃烧到加热室之后返回高温气体。

公开(公告)号：US20070284408A1

公开(公告)日：2007-12-13

申请号：US11755328

申请日：2007-05-30

申请人： Toshiyuki ASAI ,  Motohiro Yamane ,  Takayuki Matsuoka ,  Atsushi Tanaka

发明人： Toshiyuki ASAI ,  Motohiro Yamane ,  Takayuki Matsuoka ,  Atsushi Tanaka

IPC分类号： B23K1/012

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K3/08 ,  B23K2101/42

摘要： A reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, a control device to control an oxygen concentration in a high temperature gas after being burned, and a returning device to return the high temperature gas with the oxygen concentration controlled after being burned to the heating chamber.

摘要翻译： 回流炉包括：载体装置，用于承载安装有电子部件的印刷电路板; 加热室，其通过环境气体加热承载在其中的印刷电路板，以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备，其包括回收装置，用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分，用于将回收的环境气体加热至所需温度的加热装置，用于燃烧所含有的助熔剂组分的氧化催化剂 加热的环境气体，用于控制燃烧后的高温气体中的氧浓度的控制装置，以及返回装置，其将氧浓度返回到加热室后被控制。