摘要:
A magnetic testing method and apparatus can accurately detect a flaw by magnetizing a test object to such a degree that the object becomes magnetically saturated while solving the problems of a large magnetizing device is required when only a DC magnetic field is applied and that the test object generates heat when only an AC magnetic field is applied.A magnetic testing apparatus comprises a first magnetizing device for applying a DC bias magnetic field to a test object P in substantially parallel to the direction in which a flaw F to be detected extends, a second magnetizing device for applying an AC magnetic field to the test object P substantially perpendicularly to the direction in which the flaw F to be detected extends, and a detecting device for detecting leakage flux produced by the magnetization of the test object P accomplished by the first and second magnetizing devices.
摘要:
A magnetic testing apparatus 100 according to the present invention comprises: a first magnetizing device 1 for applying a DC bias magnetic field to a test object P in substantially parallel to the direction in which a flaw F to be detected extends; a second magnetizing device 2 for applying an AC magnetic field to the test object P substantially perpendicularly to the direction in which the flaw F to be detected extends; and a detecting device 3 for detecting leakage flux produced by the magnetization of the test object P accomplished by the first magnetizing device 1 and the second magnetizing device 2.
摘要:
A defect inspecting apparatus includes a first light source, a first image capture device that receives the reflection light emitted from the first light source and reflected by the outer peripheral surface of a lip part to grab the image of the outer peripheral surface of the lip part, a second light source, a second image capture device 8 that receives the reflection light emitted from the second light source and reflected by a load face to grab the image of the load face, a third light source, a third image capture device that receives the reflection light emitted from the third light source and reflected by a thread bottom face inspection zone 106 to grab the image of the thread bottom face inspection zone, and an inspection device for inspecting defects by processing the captured images grabbed by the first to third image capture devices.
摘要:
A rotary eddy current flaw detection probe device has a plurality of Θ-shaped eddy current flaw detection probes attached in a rotating disc for detecting flaws in all directions regardless of the flaw direction. Four Θ-shaped eddy current testing probes P11 to P22 are arranged around the rotation center Ds1 of a rotating disc 111, and are embedded in the disc 111. The coil planes of detector coils Ds11 to Ds22 of the testing probes P11 to P22 are parallel with each other, and are perpendicular to the rotation plane of the rotating disc 111. The coil planes of the detector coils incline at an angle θ relative to a line Y passing through the centers Ps11 and Ps12 of the probes P11 and P12. The detector coils Dc11 and Dc12 are cumulatively connected to each other, and the detector coils Dc21 and Dc22 are differentially connected to each other.
摘要:
In an eddy current testing method which involves using a rotatable eddy current testing probe in which a detection coil is arranged within an exciting coil, a change in detection sensitivity (a deviation of detection sensitivity) which changes depending on the rotational position of the detection coil is reduced. The eddy current testing probe includes an exciting coil EC1, a detection coil DC1, an exciting coil EC2 and a detection coil DC2, which are mounted on a disk DS. The eddy current testing probe is placed so as to face a circumferential surface of an object to be inspected T, which is in the shape of a circular cylinder, and the disk DS is rotated. Then, the distance (liftoff) between the detection coils DC1 and DC2 and an inspection surface changes. Therefore, also the detection sensitivity to a flaw signal changes. To reduce the change in detection sensitivity, the detection sensitivity is adjusted by detecting the rotational position (rotational angle) of the detection coils DC1 and DC2.
摘要:
A rotary eddy current flaw detection probe device has a plurality of Θ-shaped eddy current flaw detection probes attached in a rotating disc for detecting flaws in all directions regardless of the flaw direction. Four Θ-shaped eddy current testing probes P11 to P22 are arranged around the rotation center Ds1 of a rotating disc 111 and are embedded in the disc 111. The coil planes of detector coils Ds11 to Ds22 of the testing probes P11 to P22 are parallel with each other, and are perpendicular to the rotation plane of the rotating disc 111. The coil planes of the detector coils incline at an angle θ relative to a line Y passing through the centers Ps11 and Ps12 of the probes P11 and P12. The detector coils Dc11 and Dc12 are cumulatively connected to each other and the detector coils Dc21 and Dc22 are differentially connected to each other.
摘要:
In an eddy current testing method which involves using a rotatable eddy current testing probe in which a detection coil is arranged within an exciting coil, a change in detection sensitivity (a deviation of detection sensitivity) which changes depending on the rotational position of the detection coil is reduced. The eddy current testing probe includes an exciting coil EC1, a detection coil DC1, an exciting coil EC2 and a detection coil DC2, which are mounted on a disk DS. The eddy current testing probe is placed so as to face a circumferential surface of an object to be inspected T, which is in the shape of a circular cylinder, and the disk DS is rotated. Then, the distance (liftoff) between the detection coils DC1 and DC2 and an inspection surface changes. Therefore, also the detection sensitivity to a flaw signal changes. To reduce the change in detection sensitivity, the detection sensitivity is adjusted by detecting the rotational position (rotational angle) of the detection coils DC1 and DC2.
摘要:
It is an object of the present invention to provide an eddy current testing apparatus capable of accurately detecting any flaws occurring in a columnar or cylindrical subject to be tested regardless of their extending directions, with the use of the same probe coil.The eddy current testing apparatus 100 according to the present invention comprises a spinning plate 1 and a probe coil 2 disposed on the spinning plate 1. The probe coil is a probe coil capable of obtaining a differential output about a scanning direction of a detection signal which corresponds to a detected eddy current induced in the subject to be tested. The spinning plate is disposed in such a position that a spinning center RC of the spinning plate faces with an axial center PC of the subject to be tested. A distance R between the spinning center of the spinning plate and a center of the probe coil is set so that a difference between a maximum amplitude of a differential output at an axially extending artificial flaw provided in the subject to be tested and a maximum amplitude of a differential output at a circumferentially extending artificial flaw provided in the subject to be tested falls within a predetermined range.
摘要:
A method for producing a semiconductor device including a first conductor disposed on a semiconductor substrate; an oxygen-containing insulation film disposed on the semiconductor substrate and on the first conductor, the insulation film having a contact hole which extends to the first conductor and a trench which is connected to an upper portion of the contact hole; a zirconium oxide film disposed on a side surface of the contact hole and a side surface and a bottom surface of the trench; a zirconium film disposed on the zirconium oxide film inside the contact hole and inside the trench; and a second conductor composed of Cu embedded into the contact hole and into the trench.
摘要:
An interlayer insulating film having a concave portion is formed on a semiconductor substrate. A tight adhesion film is formed on the inner surface of the concave portion and the upper surface of the insulating film. The surface of the adhesion layer is covered with an auxiliary film made of Cu alloy containing a first metal element. A conductive member containing a second metal element other than the first metal element is embedded in the concave portion, and deposited on the auxiliary film. Heat treatment is performed to make atoms of the first metal element in the auxiliary film segregate on the inner surface of the concave portion. The adhesion layer contains an element for enhancing tight adhesion of the auxiliary film more than if the auxiliary film is deposited directly on a surface of the interlayer insulating film. During the period until the barrier layer having also the function of enhancing tight adhesion, it becomes possible to retain sufficient tight adhesion of a wiring member and prevent peel-off of the wiring member.