Method of programming and erasing a SNNNS type non-volatile memory cell
    1.
    发明授权
    Method of programming and erasing a SNNNS type non-volatile memory cell 有权
    编程和擦除SNNNS型非易失性存储单元的方法

    公开(公告)号:US06512696B1

    公开(公告)日:2003-01-28

    申请号:US09986932

    申请日:2001-11-13

    IPC分类号: G11C1604

    CPC分类号: G11C16/12 G11C16/14

    摘要: A method of programming and erasing a SNNNS type non-volatile memory cell is provided. The programming operation is performed by channel hot electron injection from a drain side to an intermediate silicon nitride layer. The erasing operation is performed by channel hot hole injection from a drain side to an intermediate silicon nitride layer. The SNNNS type non-volatile memory cell provides highly efficient hot carrier injection under low applied voltages, both for programming and erasing operations. Thus, the present method provides improved performance characteristics such as shorter programming/erasing times and lower applied voltages.

    摘要翻译: 提供了一种编程和擦除SNNNS型非易失性存储单元的方法。 通过从漏极侧到中间氮化硅层的通道热电子注入来进行编程动作。 擦除操作通过从漏极侧到中间氮化硅层的通道热空穴注入来进行。 SNNNS型非易失性存储单元在低施加电压下提供高效率的热载流子注入,用于编程和擦除操作。 因此,本方法提供改进的性能特征,例如较短的编程/擦除时间和较低的施加电压。

    Method for fabricating a memory device with a floating gate
    2.
    发明授权
    Method for fabricating a memory device with a floating gate 有权
    用于制造具有浮动栅极的存储器件的方法

    公开(公告)号:US06444523B1

    公开(公告)日:2002-09-03

    申请号:US09860422

    申请日:2001-05-18

    IPC分类号: H01L21336

    CPC分类号: H01L27/11521 H01L27/115

    摘要: A fabrication method for a memory device with a floating gate is provided. A substrate is provided. A channel doping step is performed on the substrate, wherein the actual threshold voltage of the subsequently formed memory device becomes greater than the preset threshold voltage. A stack gate and source/drain regions are then sequentially formed on the substrate to complete the formation of the memory device. The drain-turn-on leakage is prevented by an increase of the actual threshold voltage.

    摘要翻译: 提供一种具有浮动栅极的存储器件的制造方法。 提供基板。 在衬底上执行沟道掺杂步骤,其中随后形成的存储器件的实际阈值电压变得大于预设阈值电压。 然后在衬底上顺序地形成堆叠栅极和源极/漏极区,以完成存储器件的形成。 通过实际阈值电压的增加来防止漏极导通泄漏。

    Method for forming nitride read only memory
    3.
    发明授权
    Method for forming nitride read only memory 有权
    用于形成氮化物只读存储器的方法

    公开(公告)号:US06576511B2

    公开(公告)日:2003-06-10

    申请号:US09847110

    申请日:2001-05-02

    IPC分类号: H01L21336

    CPC分类号: H01L29/66833

    摘要: A semiconductor substrate having a source/drain region is initially provided, wherein a channel is formed in the space between the source/drain region within the semiconductor substrate. Then the oxide-nitride-oxide layers are formed on the semiconductor substrate, wherein the nitride layer is a charge trapping layer. Afterward, an electrically conductive material layer such as a gate is formed on and overlays the oxide-nitride-oxide layers. Subsequently, the memory cell is programmed by ultraviolet light irradiation to increase the threshold voltage of the memory cell.

    摘要翻译: 首先提供具有源极/漏极区域的半导体衬底,其中在半导体衬底内的源极/漏极区域之间的空间中形成沟道。 然后,氧化物 - 氮化物 - 氧化物层形成在半导体衬底上,其中氮化物层是电荷俘获层。 之后,在氧化物 - 氮化物 - 氧化物层上形成导电材料层,例如栅极,并覆盖氧化物 - 氮化物 - 氧化物层。 随后,通过紫外光照射来对存储单元进行编程以增加存储单元的阈值电压。