Abstract:
High-density thermodynamically stable nanostructured copper-based metallic systems, and methods of making, are presented herein. A ternary high-density thermodynamically stable nanostructured copper-based metallic system includes: a solvent of copper (Cu) metal; that comprises 50 to 95 atomic percent (at. %) of the metallic system; a first solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system; and a second solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system. The internal grain size of the solvent is suppressed to no more than 250 nm at 98% of the melting point temperature of the solvent and the solute metals remain uniformly dispersed in the solvent at that temperature. Processes for forming these metallic systems include: subjecting powder metals to a high-energy milling process, and consolidating the resultant powder metal subjected to the milling to form a bulk material.
Abstract:
The invention is an apparatus and method for safely depressurizing milling vials. The invention utilizes a machinist vise in communication with a pneumatic air cylinder mounted in a jig inside glove box enclosure. The invention utilizes a method for safely depressurizing milling vials. The milling vials are placed into the machinist vise inside the enclosure. The ram of the pneumatic air cylinder is placed on top of the milling vial and the pneumatic air cylinder is pressed firmly against the cap of the milling vial. Next, the air inside the enclosure is evacuated of atmosphere after which the pressure is slowly released from the pneumatic air cylinder. During this stage of the method the operator is a safe distance from the enclosure. As pressure is removed from the pneumatic air cylinder the ram is retracted and the cap of milling vial is removed.
Abstract:
High-density thermodynamically stable nanostructured copper-based metallic systems, and methods of making, are presented herein. A ternary high-density thermodynamically stable nanostructured copper-based metallic system includes: a solvent of copper (Cu) metal; that comprises 50 to 95 atomic percent (at. %) of the metallic system; a first solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system; and a second solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system. The internal grain size of the solvent is suppressed to no more than 250 nm at 98% of the melting point temperature of the solvent and the solute metals remain uniformly dispersed in the solvent at that temperature. Processes for forming these metallic systems include: subjecting powder metals to a high-energy milling process, and consolidating the resultant powder metal subjected to the milling to form a bulk material.
Abstract:
Nanostructured or ultra-fine grained metallic systems according to embodiments of the invention may be formed of: pure Cu, pure Fe, or pure Ti, with grain sizes of less than 140 nm, 348 nm, or 59 nm, respectively. The metallic systems demonstrate a monotonically increasing grain size dependence from a minimum value attained at the surface; and a converse relation of microhardness, decreasing from 160 kg/mm2, 265 kg/mm2, or 320 kg/mm2, respectively. The grain refinement process at cryogenic conditions relies on the suppression of room temperature dislocation-mediated deformation mechanisms which facilitate grain restructuring, relaxation, and reorientation. At the cryogenic conditions, alternative mechanism for grain refinement, such as shear localization or dynamic recrystallization may be more dominant. Processes for refining the grain size of these metallic systems may include: subjecting metal plates to a high-energy milling process using a high-energy milling device to impart high impact energies to its surface. Due to the high-efficiency of this attrition process, these metallic systems are ideal candidates for improved corrosion and wear resistance.
Abstract translation:根据本发明的实施方案的纳米结构或超细晶粒金属体系可以分别由具有小于140nm,348nm或59nm的晶粒尺寸的纯Cu,纯Fe或纯Ti形成。 金属系统表现出从表面达到的最小值单调递增的晶粒尺寸依赖性; 和显微硬度的相关关系,分别从160 kg / mm2,265 kg / mm2或320 kg / mm2下降。 低温条件下的晶粒细化过程依赖于抑制室温位错介导的变形机制,促进晶粒重组,松弛和重新取向。 在低温条件下,晶粒细化的替代机理如剪切定位或动态重结晶可能更为主导。 用于精炼这些金属体系的晶粒尺寸的方法可以包括:使用高能铣削装置对金属板进行高能量铣削加工,以赋予其表面高的冲击能。 由于这种磨损过程的高效率,这些金属系统是改善耐腐蚀和耐磨性的理想选择。
Abstract:
The invention is an apparatus and method for safely depressurizing milling vials. The invention utilizes a machinist vise in communication with a pneumatic air cylinder mounted in a jig inside glove box enclosure. The invention utilizes a method for safely depressurizing milling vials. The milling vials are placed into the machinist vise inside the enclosure. The ram of the pneumatic air cylinder is placed on top of the milling vial and the pneumatic air cylinder is pressed firmly against the cap of the milling vial. Next, the air inside the enclosure is evacuated of atmosphere after which the pressure is slowly released from the pneumatic air cylinder. During this stage of the method the operator is a safe distance from the enclosure. As pressure is removed from the pneumatic air cylinder the ram is retracted and the cap of milling vial is removed.