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公开(公告)号:US12059855B1
公开(公告)日:2024-08-13
申请号:US17029117
申请日:2020-09-23
Inventor: Jason Parker , Tony Kayhart , Damian Kubiak , Robert Sykes
IPC: B29C70/56 , B29C70/46 , B29K77/00 , B29K105/08 , B29K307/04 , B29L31/00 , F41H1/08 , F41H5/04
CPC classification number: B29C70/56 , B29C70/465 , F41H1/08 , F41H5/0485 , B29C2793/0081 , B29K2077/10 , B29K2105/0881 , B29K2307/04 , B29L2031/768
Abstract: A method of forming a net shape preform for a high performance ballistic helmet includes preparing one or more full prepreg plies, preparing one or more filler prepreg plies, wherein a shape and orientation of one filler prepreg ply of the one or more filler prepreg plies is different from a shape and orientation of another filler prepreg ply of the one or more filler prepreg plies, layering the one or more full prepreg plies with one or more filler prepreg plies to form a ply stack and deforming a portion of the ply stack while constraining the ply stack by applying in-plane tensional force to the ply stack to form the net-shape preform.
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公开(公告)号:US10737445B1
公开(公告)日:2020-08-11
申请号:US15883379
申请日:2018-01-30
Inventor: Tony J Kayhart , Jason C Parker , Nicholas Tsantinis , John W Song , Damian Kubiak
Abstract: A method, apparatus, and system for winding a filament around a substrate includes mounting the substrate to a rotatable structure and rotating the substrate to wind the first filament around the substrate in a first winding orientation that winds the first filament around a first pair of edges of the substrate to wrap a first filament layer around the substrate. The method further includes changing winding orientations of the first filament from the first winding orientation to a second winding orientation by turning the first filament about a corner of the substrate and winding the first filament around the rotating substrate in the second winding orientation that winds the first filament around a second pair of edges of the substrate, wherein the second pair of edges is different from the first pair of edges, to wrap a second filament layer around the substrate.
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